Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366853 | Sensor metrology data integration | Sidharth Bhatia, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil | 2025-07-22 |
| 11853042 | Part, sensor, and metrology data integration | Sidharth Bhatia, Katty Marie Lydia Gamon Guyomard, Shawyon Jafari, Heng-Cheng Pai, Pramod Nambiar +2 more | 2023-12-26 |
| 11592812 | Sensor metrology data integration | Sidharth Bhatia, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil | 2023-02-28 |
| 11241769 | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes | David Masayuki Ishikawa, Jeonghoon Oh, Charles C. Garretson, Huanbo Zhang, Chia-Ling PAI +2 more | 2022-02-08 |
| 11157661 | Process development visualization tool | Vinayak Veer Vats, Sidharth Bhatia, Pramod Nambiar, Hang Yu, Sanjay Kamath +2 more | 2021-10-26 |
| 10610994 | Polishing system with local area rate control and oscillation mode | Eric Lau, Hui Chen, King Yi Heung, Chih Chung Chou, Edwin C. Suarez +2 more | 2020-04-07 |
| 10493590 | Selection of polishing parameters to generate removal or pressure profile | Huanbo Zhang, King Yi Heung, Nathan Bohannon, Qing Zhang | 2019-12-03 |
| 10434623 | Local area polishing system and polishing pad assemblies for a polishing system | Eric Lau, Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou +3 more | 2019-10-08 |
| 10252397 | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes | David Masayuki Ishikawa, Jeonghoon Oh, Charles C. Garretson, Huanbo Zhang, Chia-Ling PAI +2 more | 2019-04-09 |
| 9873179 | Carrier for small pad for chemical mechanical polishing | Hui Chen, Steven M. Zuniga, Hung Chih Chen, Eric Lau, Shou-Sung Chang | 2018-01-23 |
| 9213340 | Selection of polishing parameters to generate removal or pressure profile | Huanbo Zhang, King Yi Heung, Nathan Bohannon, Qing Zhang | 2015-12-15 |
| 8774958 | Selection of polishing parameters to generate removal profile | Huanbo Zhang, King Yi Heung, Nathan Bohannon, Qing Zhang | 2014-07-08 |
| 8628376 | In-line wafer thickness sensing | Sanjeev Kumar Jain, Boguslaw A. Swedek, Lakshmanan Karuppiah | 2014-01-14 |
| 8372210 | Post CMP scrubbing of substrates | Terry Kin Ting Ko, Sidney P. Huey | 2013-02-12 |
| 8205352 | Vapor dryer having hydrophilic end effector | John Lewis, Michael Biese, Chidambara A. Ramalingam, Balaji Chandrasekaran, Tak Fan (Kerry) Ling | 2012-06-26 |
| 8202738 | Endpoint method using peak location of modified spectra | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu | 2012-06-19 |
| 7980000 | Vapor dryer having hydrophilic end effector | John Lewis, Michael Biese, Chidambara A. Ramalingam, Balaji Chandrasekaran, Tak Fan (Kerry) Ling | 2011-07-19 |