| 12491603 |
Passive acoustic monitoring and acoustic sensors for chemical mechanical polishing |
Nicholas A. Wiswell, Sohrab Pourmand, Thomas H. Osterheld, Boguslaw A. Swedek |
2025-12-09 |
|
| 12322659 |
Pixel classification of film non-uniformity based on processing of substrate images |
Nojan Motamedi |
2025-06-03 |
|
| 12288724 |
Region classification of film non-uniformity based on processing of substrate images |
Nojan Motamedi |
2025-04-29 |
|
| 12272047 |
Residue measurement from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2025-04-08 |
|
| 12257665 |
Machine vision as input to a CMP process control algorithm |
Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Boguslaw A. Swedek, Thomas H. Osterheld |
2025-03-25 |
|
| 12233505 |
Polishing system with capacitive shear sensor |
Nicholas A. Wiswell, Chih Chung Chou |
2025-02-25 |
|
| 12169925 |
System using film thickness estimation from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2024-12-17 |
$116,184,000 |
| 12148148 |
Thickness measurement of substrate using color metrology |
— |
2024-11-19 |
$80,955,000 |
| 11931860 |
Consumable part monitoring in chemical mechanical polisher |
Thomas H. Osterheld |
2024-03-19 |
$54,086,000 |
| 11847776 |
System using film thickness estimation from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2023-12-19 |
$56,890,000 |
| 11836913 |
Film thickness estimation from machine learning based processing of substrate images |
Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha |
2023-12-05 |
$45,995,000 |
| 11776109 |
Thickness measurement of substrate using color metrology |
Nojan Motamedi, Boguslaw A. Swedek, Martin A. Josefowicz |
2023-10-03 |
$34,462,000 |
| 11715672 |
Endpoint detection for chemical mechanical polishing based on spectrometry |
Jeffrey Drue David, Boguslaw A. Swedek |
2023-08-01 |
$66,604,000 |
| 11715193 |
Color imaging for CMP monitoring |
Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid |
2023-08-01 |
$66,604,000 |
| 11701749 |
Monitoring of vibrations during chemical mechanical polishing |
Boguslaw A. Swedek, Chih Chung Chou, Nicholas A. Wiswell, Thomas H. Osterheld, Jeonghoon Oh |
2023-07-18 |
$58,990,000 |
| 11699595 |
Imaging for monitoring thickness in a substrate cleaning system |
Jun Qian, Boguslaw A. Swedek, Thomas H. Osterheld |
2023-07-11 |
$39,838,000 |
| 11682114 |
Thickness measurement of substrate using color metrology |
— |
2023-06-20 |
$48,645,000 |
| 11660722 |
Polishing system with capacitive shear sensor |
Nicholas A. Wiswell, Chih Chung Chou |
2023-05-30 |
$32,229,000 |
| 11577356 |
Machine vision as input to a CMP process control algorithm |
Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Boguslaw A. Swedek, Thomas H. Osterheld |
2023-02-14 |
$35,617,000 |
| 11571786 |
Consumable part monitoring in chemical mechanical polisher |
Thomas H. Osterheld |
2023-02-07 |
$44,390,000 |
| 11557048 |
Thickness measurement of substrate using color metrology |
Boguslaw A. Swedek |
2023-01-17 |
$39,427,000 |
| 11315232 |
Residue detection using a luminance histogram |
Nojan Motamedi |
2022-04-26 |
$43,127,000 |
| 11183435 |
Endpointing detection for chemical mechanical polishing based on spectrometry |
Jeffrey Drue David, Boguslaw A. Swedek |
2021-11-23 |
$124,354,000 |
| 11100628 |
Thickness measurement of substrate using color metrology |
Nojan Motamedi, Boguslaw A. Swedek, Martin A. Josefowicz |
2021-08-24 |
$92,770,000 |
| 11072050 |
Polishing pad with window and manufacturing methods thereof |
Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin CHOCKALINGAM +4 more |
2021-07-27 |
$132,720,000 |
