Issued Patents All Time
Showing 25 most recent of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322659 | Pixel classification of film non-uniformity based on processing of substrate images | Nojan Motamedi | 2025-06-03 |
| 12288724 | Region classification of film non-uniformity based on processing of substrate images | Nojan Motamedi | 2025-04-29 |
| 12272047 | Residue measurement from machine learning based processing of substrate images | Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha | 2025-04-08 |
| 12257665 | Machine vision as input to a CMP process control algorithm | Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Boguslaw A. Swedek, Thomas H. Osterheld | 2025-03-25 |
| 12233505 | Polishing system with capacitive shear sensor | Nicholas A. Wiswell, Chih Chung Chou | 2025-02-25 |
| 12169925 | System using film thickness estimation from machine learning based processing of substrate images | Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha | 2024-12-17 |
| 12148148 | Thickness measurement of substrate using color metrology | — | 2024-11-19 |
| 11931860 | Consumable part monitoring in chemical mechanical polisher | Thomas H. Osterheld | 2024-03-19 |
| 11847776 | System using film thickness estimation from machine learning based processing of substrate images | Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha | 2023-12-19 |
| 11836913 | Film thickness estimation from machine learning based processing of substrate images | Sivakumar Dhandapani, Arash Alahgholipouromrani, Jun Qian, Kiran Shrestha | 2023-12-05 |
| 11776109 | Thickness measurement of substrate using color metrology | Nojan Motamedi, Boguslaw A. Swedek, Martin A. Josefowicz | 2023-10-03 |
| 11715672 | Endpoint detection for chemical mechanical polishing based on spectrometry | Jeffrey Drue David, Boguslaw A. Swedek | 2023-08-01 |
| 11715193 | Color imaging for CMP monitoring | Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid | 2023-08-01 |
| 11701749 | Monitoring of vibrations during chemical mechanical polishing | Boguslaw A. Swedek, Chih Chung Chou, Nicholas A. Wiswell, Thomas H. Osterheld, Jeonghoon Oh | 2023-07-18 |
| 11699595 | Imaging for monitoring thickness in a substrate cleaning system | Jun Qian, Boguslaw A. Swedek, Thomas H. Osterheld | 2023-07-11 |
| 11682114 | Thickness measurement of substrate using color metrology | — | 2023-06-20 |
| 11660722 | Polishing system with capacitive shear sensor | Nicholas A. Wiswell, Chih Chung Chou | 2023-05-30 |
| 11577356 | Machine vision as input to a CMP process control algorithm | Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Boguslaw A. Swedek, Thomas H. Osterheld | 2023-02-14 |
| 11571786 | Consumable part monitoring in chemical mechanical polisher | Thomas H. Osterheld | 2023-02-07 |
| 11557048 | Thickness measurement of substrate using color metrology | Boguslaw A. Swedek | 2023-01-17 |
| 11315232 | Residue detection using a luminance histogram | Nojan Motamedi | 2022-04-26 |
| 11183435 | Endpointing detection for chemical mechanical polishing based on spectrometry | Jeffrey Drue David, Boguslaw A. Swedek | 2021-11-23 |
| 11100628 | Thickness measurement of substrate using color metrology | Nojan Motamedi, Boguslaw A. Swedek, Martin A. Josefowicz | 2021-08-24 |
| 11072050 | Polishing pad with window and manufacturing methods thereof | Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin CHOCKALINGAM +4 more | 2021-07-27 |
| 11017524 | Thickness measurement of substrate using color metrology | — | 2021-05-25 |