Issued Patents All Time
Showing 26–50 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10948900 | Display of spectra contour plots versus time for semiconductor processing system control | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek | 2021-03-16 |
| 10766119 | Spectra based endpointing for chemical mechanical polishing | Boguslaw A. Swedek, Jeffrey Drue David | 2020-09-08 |
| 10741459 | Inductive monitoring of conductive loops | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Ingemar Carlsson +2 more | 2020-08-11 |
| 10565701 | Color imaging for CMP monitoring | Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid | 2020-02-18 |
| 10325364 | Thickness measurement of substrate using color metrology | — | 2019-06-18 |
| 10276460 | Endpointing detection for chemical mechanical polishing based on spectrometry | Jeffrey Drue David, Boguslaw A. Swedek | 2019-04-30 |
| 10103073 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Ingemar Carlsson +2 more | 2018-10-16 |
| 9886026 | Endpoint method using peak location of spectra contour plots versus time | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek | 2018-02-06 |
| 9799578 | Peak-based endpointing for chemical mechanical polishing | Boguslaw A. Swedek, David J. Lischka | 2017-10-24 |
| 9754846 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Ingemar Carlsson +2 more | 2017-09-05 |
| 9607910 | Limiting adjustment of polishing rates during substrate polishing | Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee | 2017-03-28 |
| 9583405 | Endpointing detection for chemical mechanical polishing based on spectrometry | Jeffrey Drue David, Boguslaw A. Swedek | 2017-02-28 |
| 9564377 | Peak-based endpointing for chemical mechanical polishing | Boguslaw A. Swedek, David J. Lischka | 2017-02-07 |
| 9496190 | Feedback of layer thickness timing and clearance timing for polishing control | Kun Xu, Feng Q. Liu, Boguslaw A. Swedek, Yuchun Wang, Wen-Chiang Tu +1 more | 2016-11-15 |
| 9490186 | Limiting adjustment of polishing rates during substrate polishing | Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee | 2016-11-08 |
| 9375824 | Adjustment of polishing rates during substrate polishing with predictive filters | Benjamin Cherian, Sivakumar Dhandapani, Harry Q. Lee | 2016-06-28 |
| 9346146 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek | 2016-05-24 |
| 9308618 | Linear prediction for filtering of data during in-situ monitoring of polishing | — | 2016-04-12 |
| 9233450 | Optical detection of metal layer clearance | Jeffrey Drue David | 2016-01-12 |
| 9227293 | Multi-platen multi-head polishing architecture | Jeffrey Drue David, Boguslaw A. Swedek, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian +3 more | 2016-01-05 |
| 9186774 | X-ray metrology for control of polishing | Boguslaw A. Swedek, Wen-Chiang Tu | 2015-11-17 |
| 9168630 | User-input functions for data sequences in polishing endpoint detection | Harry Q. Lee, Jeffrey Drue David, Boguslaw A. Swedek | 2015-10-27 |
| 9138858 | Thin polishing pad with window and molding process | Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek | 2015-09-22 |
| 9142466 | Using spectra to determine polishing endpoints | Harry Q. Lee, Boguslaw A. Swedek, Jeffrey Drue David | 2015-09-22 |
| 9117751 | Endpointing detection for chemical mechanical polishing based on spectrometry | Jeffrey Drue David, Boguslaw A. Swedek | 2015-08-25 |