Issued Patents All Time
Showing 76–100 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8535115 | Gathering spectra from multiple optical heads | Jeffrey Drue David, Boguslaw A. Swedek, Sivakumar Dhandapani | 2013-09-17 |
| 8518827 | Spectrum based endpointing for chemical mechanical polishing | Jeffrey Drue David, Boguslaw A. Swedek | 2013-08-27 |
| 8475228 | Polishing pad with partially recessed window | Boguslaw A. Swedek, Jimin Zhang | 2013-07-02 |
| 8393940 | Molding windows in thin pads | Boguslaw A. Swedek, Doyle E. Bennett | 2013-03-12 |
| 8393933 | Polishing pad and system with window support | Jun Qian, Ningzhuo Cui, Boguslaw A. Swedek, Thomas H. Osterheld | 2013-03-12 |
| 8369978 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek | 2013-02-05 |
| 8352061 | Semi-quantitative thickness determination | Boguslaw A. Swedek, Jeffrey Drue David, Harry Q. Lee | 2013-01-08 |
| 8342906 | Friction sensor for polishing system | Gabriel L. Miller, Manoocher Birang, Nils Johansson, Boguslaw A. Swedek | 2013-01-01 |
| 8292693 | Using optical metrology for wafer to wafer feed back process control | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Zhize Zhu, Wen-Chiang Tu | 2012-10-23 |
| 8260446 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah | 2012-09-04 |
| 8202738 | Endpoint method using peak location of modified spectra | Jeffrey Drue David, Garrett H. Sin, Harry Q. Lee | 2012-06-19 |
| 8125654 | Methods and apparatus for measuring substrate edge thickness during polishing | Boguslaw A. Swedek, Sen-Hou Ko, Abraham Ravid, Paul V. Miller | 2012-02-28 |
| 8088298 | Spectra based endpointing for chemical mechanical polishing | Boguslaw A. Swedek, Jeffrey Drue David | 2012-01-03 |
| 8039397 | Using optical metrology for within wafer feed forward process control | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Zhize Zhu, Wen-Chiang Tu | 2011-10-18 |
| 8014004 | Determining physical property of substrate | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson +2 more | 2011-09-06 |
| 7998358 | Peak-based endpointing for chemical mechanical polishing | Bogdan Swedek, David J. Lischka | 2011-08-16 |
| 7952708 | High throughput measurement system | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Sidney P. Huey +3 more | 2011-05-31 |
| 7942724 | Polishing pad with window having multiple portions | Boguslaw A. Swedek, Jimin Zhang | 2011-05-17 |
| 7938714 | Polishing pad assembly with glass or crystalline window | Jeffrey Drue David, Bogdan Swedek | 2011-05-10 |
| 7931522 | Removable optical monitoring system for chemical mechanical polishing | Jeffrey Drue David, Bogdan Swedek | 2011-04-26 |
| 7840375 | Methods and apparatus for generating a library of spectra | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Sidney P. Huey +3 more | 2010-11-23 |
| 7774086 | Substrate thickness measuring during polishing | Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah | 2010-08-10 |
| 7768659 | Determining copper concentration in spectra | Jeffrey Drue David, Boguslaw A. Swedek, Jimin Zhang, Harry Q. Lee | 2010-08-03 |
| 7764377 | Spectrum based endpointing for chemical mechanical polishing | Jeffrey Drue David, Bogdan Swedek | 2010-07-27 |
| 7746485 | Determining physical property of substrate | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson +2 more | 2010-06-29 |