Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711381 | Methods and apparatus for post-chemical mechanical planarization substrate cleaning | Lakshmanan Karuppiah | 2017-07-18 |
| 9646859 | Disk-brush cleaner module with fluid jet | Hui Chen, Allen L. D'Ambra, Yufei Chen, Adrian Blank, Mario David Silvetti +2 more | 2017-05-09 |
| 9508575 | Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing | Hui Chen | 2016-11-29 |
| 8813293 | Apparatus and methods for brush and pad conditioning | Lakshmanan Karuppiah | 2014-08-26 |
| 8550879 | Polishing pad conditioner | Hung Chih Chen, Shou-Sung Chang | 2013-10-08 |
| 8458843 | Apparatus and methods for brush and pad conditioning | Lakshmanan Karuppiah | 2013-06-11 |
| 8142260 | Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads | Eashwer Chandra Vidhya Sagar Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Antoine P. Manens +2 more | 2012-03-27 |
| 8125654 | Methods and apparatus for measuring substrate edge thickness during polishing | Dominic J. Benvegnu, Boguslaw A. Swedek, Abraham Ravid, Paul V. Miller | 2012-02-28 |
| 7993485 | Methods and apparatus for processing a substrate | Erik C. Wasinger, Gary C. Ettinger, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin +1 more | 2011-08-09 |
| 7828626 | Apparatus for conditioning processing pads | Paul D. Butterfield | 2010-11-09 |
| 7749048 | Polishing pad conditioning process | James C. Wang, Hung K. Nguyen, Wei-Yung Hsu | 2010-07-06 |
| 7666061 | Method for conditioning processing pads | Paul D. Butterfield | 2010-02-23 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2007-04-24 |
| 7199056 | Low cost and low dishing slurry for polysilicon CMP | Kevin Song | 2007-04-03 |
| 7182680 | Apparatus for conditioning processing pads | Paul D. Butterfield | 2007-02-27 |
| 7175505 | Method for adjusting substrate processing times in a substrate polishing system | Harry Q. Lee, Wei-Yung Hsu | 2007-02-13 |
| 7115024 | Profile control platen | Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Mohsen Salek | 2006-10-03 |
| 7104267 | Planarized copper cleaning for reduced defects | Ramin Emami, Shijian Li, Fred C. Redeker, Madhavi R. Chandrachood | 2006-09-12 |
| 7040971 | Carrier head with a flexible membrane | Steven M. Zuniga, Manoocher Birang, Hung Chih Chen | 2006-05-09 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2006-01-31 |
| 6913518 | Profile control platen | Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Mohsen Salek | 2005-07-05 |
| 6896584 | Method of controlling carrier head with multiple chambers | Ilya Perlov, Eugene Gantvarg | 2005-05-24 |
| 6857946 | Carrier head with a flexure | Steven M. Zuniga, Manoocher Birang, Hung Chih Chen | 2005-02-22 |
| 6824455 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Thomas H. Osterheld | 2004-11-30 |
| 6699115 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Thomas H. Osterheld | 2004-03-02 |