| 9711381 |
Methods and apparatus for post-chemical mechanical planarization substrate cleaning |
Lakshmanan Karuppiah |
2017-07-18 |
$23,942,000 |
| 9646859 |
Disk-brush cleaner module with fluid jet |
Hui Chen, Allen L. D'Ambra, Yufei Chen, Adrian Blank, Mario David Silvetti +2 more |
2017-05-09 |
$25,128,000 |
| 9508575 |
Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing |
Hui Chen |
2016-11-29 |
$13,456,000 |
| 8813293 |
Apparatus and methods for brush and pad conditioning |
Lakshmanan Karuppiah |
2014-08-26 |
$21,976,000 |
| 8550879 |
Polishing pad conditioner |
Hung Chih Chen, Shou-Sung Chang |
2013-10-08 |
$11,511,000 |
| 8458843 |
Apparatus and methods for brush and pad conditioning |
Lakshmanan Karuppiah |
2013-06-11 |
$13,536,000 |
| 8142260 |
Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads |
Eashwer Chandra Vidhya Sagar Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Antoine P. Manens +2 more |
2012-03-27 |
$13,154,000 |
| 8125654 |
Methods and apparatus for measuring substrate edge thickness during polishing |
Dominic J. Benvegnu, Boguslaw A. Swedek, Abraham Ravid, Paul V. Miller |
2012-02-28 |
$8,688,000 |
| 7993485 |
Methods and apparatus for processing a substrate |
Erik C. Wasinger, Gary C. Ettinger, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin +1 more |
2011-08-09 |
$4,845,000 |
| 7828626 |
Apparatus for conditioning processing pads |
Paul D. Butterfield |
2010-11-09 |
$8,686,000 |
| 7749048 |
Polishing pad conditioning process |
James C. Wang, Hung K. Nguyen, Wei-Yung Hsu |
2010-07-06 |
$6,398,000 |
| 7666061 |
Method for conditioning processing pads |
Paul D. Butterfield |
2010-02-23 |
$23,348,000 |
| 7207878 |
Conductive polishing article for electrochemical mechanical polishing |
Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more |
2007-04-24 |
$15,441,000 |
| 7199056 |
Low cost and low dishing slurry for polysilicon CMP |
Kevin Song |
2007-04-03 |
$19,610,000 |
| 7182680 |
Apparatus for conditioning processing pads |
Paul D. Butterfield |
2007-02-27 |
$18,545,000 |
| 7175505 |
Method for adjusting substrate processing times in a substrate polishing system |
Harry Q. Lee, Wei-Yung Hsu |
2007-02-13 |
$39,431,000 |
| 7115024 |
Profile control platen |
Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Mohsen Salek |
2006-10-03 |
$12,847,000 |
| 7104267 |
Planarized copper cleaning for reduced defects |
Ramin Emami, Shijian Li, Fred C. Redeker, Madhavi R. Chandrachood |
2006-09-12 |
$11,645,000 |
| 7040971 |
Carrier head with a flexible membrane |
Steven M. Zuniga, Manoocher Birang, Hung Chih Chen |
2006-05-09 |
$14,267,000 |
| 6991528 |
Conductive polishing article for electrochemical mechanical polishing |
Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more |
2006-01-31 |
$13,979,000 |
| 6913518 |
Profile control platen |
Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Mohsen Salek |
2005-07-05 |
$11,772,000 |
| 6896584 |
Method of controlling carrier head with multiple chambers |
Ilya Perlov, Eugene Gantvarg |
2005-05-24 |
$9,995,000 |
| 6857946 |
Carrier head with a flexure |
Steven M. Zuniga, Manoocher Birang, Hung Chih Chen |
2005-02-22 |
$18,056,000 |
| 6824455 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
Thomas H. Osterheld |
2004-11-30 |
$15,899,000 |
| 6699115 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
Thomas H. Osterheld |
2004-03-02 |
$27,245,000 |
