Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8133096 | Multi-phase polishing pad | Robert Lum, Sourabh Mishra | 2012-03-13 |
| 7497767 | Vibration damping during chemical mechanical polishing | Hung Chih Chen, Shijian Li, John M. White, Fred C. Redeker, Steven M. Zuniga +1 more | 2009-03-03 |
| 7331847 | Vibration damping in chemical mechanical polishing system | Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker | 2008-02-19 |
| 7273813 | Wafer cleaning solution for cobalt electroless application | Timothy Weidman, Sergey Lopatin, Hongbin Fang, Arulkumar Shanmugasundram | 2007-09-25 |
| 7256111 | Pretreatment for electroless deposition | Sergey Lopatin, Arulkumar Shanmugasundram, Hongbin Fang | 2007-08-14 |
| 7104267 | Planarized copper cleaning for reduced defects | Shijian Li, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood | 2006-09-12 |
| 7041599 | High through-put Cu CMP with significantly reduced erosion and dishing | Shijian Li, Fred C. Redeker, John M. White | 2006-05-09 |
| 7014538 | Article for polishing semiconductor substrates | Lawrence Rosenberg, Shijian Li, Manoocher Birang, John M. White, Marty Scales +1 more | 2006-03-21 |
| 7014545 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker | 2006-03-21 |
| 6857941 | Multi-phase polishing pad | Robert Lum, Sourabh Mishra | 2005-02-22 |
| 6832948 | Thermal preconditioning fixed abrasive articles | Manoocher Birang, Shijian Li, Fred C. Redeker | 2004-12-21 |
| 6786996 | Apparatus and method for edge bead removal | — | 2004-09-07 |
| 6708701 | Capillary ring | — | 2004-03-23 |
| 6676497 | Vibration damping in a chemical mechanical polishing system | Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker | 2004-01-13 |
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker, Lizhong Sun +1 more | 2003-12-30 |
| 6656842 | Barrier layer buffing after Cu CMP | Shijian Li, Fred C. Redeker, Sen-Hou Ko, John M. White | 2003-12-02 |
| 6592439 | Platen for retaining polishing material | Shijian Li, Manoocher Birang, Andrew J. Nagengast, Douglas Orcutt Brown, Shi-Ping Wang +2 more | 2003-07-15 |
| 6432826 | Planarized Cu cleaning for reduced defects | Shijian Li, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood | 2002-08-13 |
| 6413873 | System for chemical mechanical planarization | Shijian Li, John M. White, Lawrence Rosenberg, Martin Scales, James V. Tietz +1 more | 2002-07-02 |
| 6322427 | Conditioning fixed abrasive articles | Shijian Li, Sidney P. Huey, Fritz Redeker, John M. White | 2001-11-27 |
| 6299698 | Wafer edge scrubber and method | Brian J. Brown | 2001-10-09 |