| 8133096 |
Multi-phase polishing pad |
Robert Lum, Sourabh Mishra |
2012-03-13 |
$10,387,000 |
| 7497767 |
Vibration damping during chemical mechanical polishing |
Hung Chih Chen, Shijian Li, John M. White, Fred C. Redeker, Steven M. Zuniga +1 more |
2009-03-03 |
$11,197,000 |
| 7331847 |
Vibration damping in chemical mechanical polishing system |
Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker |
2008-02-19 |
$32,891,000 |
| 7273813 |
Wafer cleaning solution for cobalt electroless application |
Timothy Weidman, Sergey Lopatin, Hongbin Fang, Arulkumar Shanmugasundram |
2007-09-25 |
$27,615,000 |
| 7256111 |
Pretreatment for electroless deposition |
Sergey Lopatin, Arulkumar Shanmugasundram, Hongbin Fang |
2007-08-14 |
$16,337,000 |
| 7104267 |
Planarized copper cleaning for reduced defects |
Shijian Li, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood |
2006-09-12 |
$11,645,000 |
| 7041599 |
High through-put Cu CMP with significantly reduced erosion and dishing |
Shijian Li, Fred C. Redeker, John M. White |
2006-05-09 |
$14,267,000 |
| 7014538 |
Article for polishing semiconductor substrates |
Lawrence Rosenberg, Shijian Li, Manoocher Birang, John M. White, Marty Scales +1 more |
2006-03-21 |
$22,141,000 |
| 7014545 |
Vibration damping in a chemical mechanical polishing system |
Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker |
2006-03-21 |
$22,141,000 |
| 6857941 |
Multi-phase polishing pad |
Robert Lum, Sourabh Mishra |
2005-02-22 |
$18,056,000 |
| 6832948 |
Thermal preconditioning fixed abrasive articles |
Manoocher Birang, Shijian Li, Fred C. Redeker |
2004-12-21 |
$24,351,000 |
| 6786996 |
Apparatus and method for edge bead removal |
— |
2004-09-07 |
$42,451,000 |
| 6708701 |
Capillary ring |
— |
2004-03-23 |
$30,776,000 |
| 6676497 |
Vibration damping in a chemical mechanical polishing system |
Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker |
2004-01-13 |
$26,561,000 |
| 6669538 |
Pad cleaning for a CMP system |
Shijian Li, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker, Lizhong Sun +1 more |
2003-12-30 |
$36,918,000 |
| 6656842 |
Barrier layer buffing after Cu CMP |
Shijian Li, Fred C. Redeker, Sen-Hou Ko, John M. White |
2003-12-02 |
$32,739,000 |
| 6592439 |
Platen for retaining polishing material |
Shijian Li, Manoocher Birang, Andrew J. Nagengast, Douglas Orcutt Brown, Shi-Ping Wang +2 more |
2003-07-15 |
$26,921,000 |
| 6432826 |
Planarized Cu cleaning for reduced defects |
Shijian Li, Sen-Hou Ko, Fred C. Redeker, Madhavi R. Chandrachood |
2002-08-13 |
$22,156,000 |
| 6413873 |
System for chemical mechanical planarization |
Shijian Li, John M. White, Lawrence Rosenberg, Martin Scales, James V. Tietz +1 more |
2002-07-02 |
$21,510,000 |
| 6322427 |
Conditioning fixed abrasive articles |
Shijian Li, Sidney P. Huey, Fritz Redeker, John M. White |
2001-11-27 |
$67,261,000 |
| 6299698 |
Wafer edge scrubber and method |
Brian J. Brown |
2001-10-09 |
$40,152,000 |
