Issued Patents All Time
Showing 25 most recent of 138 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12000742 | Pressure gauge comprising a pressure sensor having a deflection device being controlled to apply a force to an isolation diaphragm | Igor Getman | 2024-06-04 |
| 11846555 | Pressure gauge comprising a device for deflecting an isolation diaphragm | Igor Getman | 2023-12-19 |
| 11340126 | Corrosion-protection element for a field device | Thomas Uehlin, Michael Hugel | 2022-05-24 |
| 11069888 | Anode structure with binders for silicon and stabilized lithium metal powder | Gao Liu, Eric Liu, Ajey M. Joshi, Guo Ai, Zhihui Wang +2 more | 2021-07-20 |
| 9761882 | Manufacturing of high capacity prismatic lithium-ion alloy anodes | Dmitri A. Brevnov, Eric Liu, Robert Z. Bachrach, Connie P. Wang | 2017-09-12 |
| 9583770 | Manufacturing of high capacity prismatic lithium-ion alloy anodes | Dimitri A. Brevnov, Eric Liu, Robert Z. Bachrach, Connie P. Wang | 2017-02-28 |
| 9567683 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors | Dmitri A. Brevnov, Robert Z. Bachrach | 2017-02-14 |
| 9240585 | Manufacturing of high capacity prismatic lithium-ion alloy anodes | Dmitri A. Brevnov, Eric Liu, Robert Z. Bachrach, Connie P. Wang | 2016-01-19 |
| 9070944 | Particle synthesis apparatus and methods | Lu Yang, Josef T. Hoog, Miaojun Wang, Dongli Zeng, Robert Z. Bachrach +1 more | 2015-06-30 |
| 8669011 | Nucleation and growth of tin particles into three dimensional composite active anode for lithium high capacity energy storage device | Dmitri A. Brevnov, Connie P. Wang, Robert Z. Bachrach | 2014-03-11 |
| 8546020 | Nucleation and growth of tin particles into three dimensional composite active anode for lithium high capacity energy storage device | Dmitri A. Brevnov, Connie P. Wang, Robert Z. Bachrach | 2013-10-01 |
| 8486562 | Thin film electrochemical energy storage device with three-dimensional anodic structure | Dmitri A. Brevnov, Robert Z. Bachrach | 2013-07-16 |
| 8206569 | Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors | Dmitri A. Brevnov, Robert Z. Bachrach | 2012-06-26 |
| 8192605 | Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures | Dmitri A. Brevnov, Eric Casavant, Robert Z. Bachrach | 2012-06-05 |
| 8052885 | Structural modification using electron beam activated chemical etch | Mehran Naser-Ghodsi, Garrett Pickard, Rudy F. Garcia, Ming Lun Yu, Kenneth Krzeczowski +3 more | 2011-11-08 |
| 7945086 | Tungsten plug deposition quality evaluation method by EBACE technology | Yehiel Gotkis, Mehran Nasser-Ghodsi | 2011-05-17 |
| 7879730 | Etch selectivity enhancement in electron beam activated chemical etch | Mehran Naser-Ghodsi, Garrett Pickard, Rudy F. Garcia, Tzu-Chin Chuang, Ming Lun Yu +4 more | 2011-02-01 |
| 7799182 | Electroplating on roll-to-roll flexible solar cell substrates | David Eaglesham, Charles Gay | 2010-09-21 |
| 7736928 | Precision printing electroplating through plating mask on a solar cell substrate | John O. Dukovic, David Eaglesham, Nicolay Kovarsky, Robert Z. Bachrach, John D. Busch +1 more | 2010-06-15 |
| 7704352 | High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate | Nicolay Kovarsky, David Eaglesham, John O. Dukovic, Charles Gay | 2010-04-27 |
| 7696092 | Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect | Paul R. Besser, Pin-Chin Connie Wang | 2010-04-13 |
| 7534298 | Apparatus and method of detecting the electroless deposition endpoint | Arulkumar Shanmugasundram, Manoocher Birang, Ian Pancham | 2009-05-19 |
| 7374654 | Method of making an organic memory cell | Mark S. Chang, Ramkumar Subramanian | 2008-05-20 |
| 7341633 | Apparatus for electroless deposition | Dmitry Lubomirsky, Arulkumar Shanmugasundram, Ian Pancham | 2008-03-11 |
| 7323418 | Etch-back process for capping a polymer memory device | Minh Van Ngo, Angela T. Hui | 2008-01-29 |