Issued Patents All Time
Showing 26–50 of 138 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7273813 | Wafer cleaning solution for cobalt electroless application | Ramin Emami, Timothy Weidman, Hongbin Fang, Arulkumar Shanmugasundram | 2007-09-25 |
| 7256111 | Pretreatment for electroless deposition | Arulkumar Shanmugasundram, Ramin Emami, Hongbin Fang | 2007-08-14 |
| 7226856 | Nano-electrode-array for integrated circuit interconnects | Robert W. Fiordalice, Faivel Pintchovski, Igor Ivanov, Wen Zhong Kong, Artur Kolics | 2007-06-05 |
| 7205233 | Method for forming CoWRe alloys by electroless deposition | Arulkumar Shanmugasundram, Dmitry Lubomirsky, Ian Pancham | 2007-04-17 |
| 7169706 | Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition | Paul R. Besser, Alline F. Myers, Jeremias D. Romero, Minh Quoc Tran, Lu You +1 more | 2007-01-30 |
| 7151018 | Method and apparatus for transistor sidewall salicidation | Peter Nunan | 2006-12-19 |
| 7115440 | SO2 treatment of oxidized CuO for copper sulfide formation of memory element growth | Christopher F. Lyons, Ramkumar Subramanian, James J. Xie, Angela T. Hui | 2006-10-03 |
| 7064065 | Silver under-layers for electroless cobalt alloys | Arulkumar Shanmugasundrum, Yosef Shacham-Diamand | 2006-06-20 |
| 7015504 | Sidewall formation for high density polymer memory element array | Christopher F. Lyons, Mark S. Chang, Ramkumar Subramanian, Patrick K. Cheung, Minh Van Ngo +1 more | 2006-03-21 |
| 6992004 | Implanted barrier layer to improve line reliability and method of forming same | Paul R. Besser, Matthew S. Buynoski, Minh Quoc Tran, Pin-Chin Connie Wang, Lu You +1 more | 2006-01-31 |
| 6982188 | Post CMP precursor treatment | James J. Xie, Minh Van Ngo | 2006-01-03 |
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film | — | 2005-12-13 |
| 6972254 | Manufacturing a conformal atomic liner layer in an integrated circuit interconnect | Minh Van Ngo | 2005-12-06 |
| 6943096 | Semiconductor component and method of manufacture | Connie P. Wang, Suzette K. Pangrle | 2005-09-13 |
| 6936925 | Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface | Alexander H. Nickel | 2005-08-30 |
| 6900488 | Multi-cell organic memory element and methods of operating and fabricating | Mark S. Chang, Minh Van Ngo, Patrick K. Cheung | 2005-05-31 |
| 6893895 | CuS formation by anodic sulfide passivation of copper surface | Uzodinma Okoroanyanwu, Matthew S. Buynoski | 2005-05-17 |
| 6893955 | Manufacturing seedless barrier layers in integrated circuits | Pin-Chin Connie Wang | 2005-05-17 |
| 6861349 | Method of forming an adhesion layer with an element reactive with a barrier layer | Paul R. Besser, Matthew S. Buynoski, Pin-Chin Connie Wang | 2005-03-01 |
| 6835655 | Method of implanting copper barrier material to improve electrical performance | Paul R. Besser, Matthew S. Buynoski | 2004-12-28 |
| 6836398 | System and method of forming a passive layer by a CMP process | Ramkumar Subramanian, Jane V. Oglesby, Minh Van Ngo, Mark S. Chang, Angela T. Hui +3 more | 2004-12-28 |
| 6815340 | Method of forming an electroless nucleation layer on a via bottom | Paul R. Besser, Matthew S. Buynoski, Pin-Chin Connie Wang | 2004-11-09 |
| 6811671 | Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed | Alexander H. Nickel, Joffre F. Bernard | 2004-11-02 |
| 6803267 | Silicon containing material for patterning polymeric memory element | Ramkumar Subramanian, Christopher F. Lyons, Matthew S. Buynoski, Patrick K. Cheung, Angela T. Hui +5 more | 2004-10-12 |
| 6787458 | Polymer memory device formed in via opening | Nicholas H. Tripsas, Matthew S. Buynoski, Suzette K. Pangrle, Uzodinma Okoroanyanwu, Angela T. Hui +7 more | 2004-09-07 |