Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7453274 | Detection of defects using transient contrast | Lei Zhong, John Fretwell, Kara L. Sherman | 2008-11-18 |
| 7446416 | Barrier material formation in integrated circuit structures | Faivel Pintchovski | 2008-11-04 |
| 7226856 | Nano-electrode-array for integrated circuit interconnects | Sergey Lopatin, Faivel Pintchovski, Igor Ivanov, Wen Zhong Kong, Artur Kolics | 2007-06-05 |
| 6949457 | Barrier enhancement | Faivel Pintchovski | 2005-09-27 |
| 6862096 | Defect detection system | Mehdi Vaez-Iravani, Jeffrey Rzepiela, Carl Treadwell, Andrew Zeng | 2005-03-01 |
| 6538730 | Defect detection system | Mehdi Vaez-Iravani, Jeffrey Rzepiela, Carl Treadwell, Andrew Zeng | 2003-03-25 |
| 6218302 | Method for forming a semiconductor device | Gregor Braeckelmann, Ramnath Venkatraman, Matthew T. Herrick, Cindy Reidsema Simpson, Dean J. Denning +2 more | 2001-04-17 |
| 6218733 | Semiconductor device having a titanium-aluminum compound | Stanley M. Filipiak, Johnson O. Olowolafe, Hisao Kawasaki | 2001-04-17 |
| 6187682 | Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material | Dean J. Denning, Rama I. Hegde, Sam S. Garcia | 2001-02-13 |
| 6077768 | Process for fabricating a multilevel interconnect | T. P. Ong, Ramnath Venkatraman | 2000-06-20 |
| 5814557 | Method of forming an interconnect structure | Ramnath Venkatraman, Elizabeth J. Weitzman | 1998-09-29 |
| 5801098 | Method of decreasing resistivity in an electrically conductive layer | Sam S. Garcia, T. P. Ong | 1998-09-01 |
| 5783485 | Process for fabricating a metallized interconnect | T. P. Ong, Ramnath Venkatraman, Elizabeth J. Weitzman | 1998-07-21 |
| 5677231 | Method for providing trench isolation | Papu D. Maniar | 1997-10-14 |
| 5652176 | Method for providing trench isolation and borderless contact | Papu D. Maniar | 1997-07-29 |
| 5633199 | Process for fabricating a metallized interconnect structure in a semiconductor device | Roc Blumenthal | 1997-05-27 |
| 5580823 | Process for fabricating a collimated metal layer and contact structure in a semiconductor device | Rama I. Hegde, Dave Kolar | 1996-12-03 |
| 5578523 | Method for forming inlaid interconnects in a semiconductor device | Papu D. Maniar, Jeffrey L. Klein | 1996-11-26 |
| 5534462 | Method for forming a plug and semiconductor device having the same | Papu D. Maniar, Jeffrey L. Klein, Bernard J. Roman | 1996-07-09 |
| 5525542 | Method for making a semiconductor device having anti-reflective coating | Papu D. Maniar, Kevin Kemp, Bernard J. Roman | 1996-06-11 |
| 5429989 | Process for fabricating a metallization structure in a semiconductor device | Faivel Pintchovski | 1995-07-04 |
| 5420072 | Method for forming a conductive interconnect in an integrated circuit | Johnson O. Olowolafe, Hisao Kawasaki | 1995-05-30 |
| 5391517 | Process for forming copper interconnect structure | Avgerinos V. Gelatos | 1995-02-21 |
| 5358615 | Process for forming a sputter deposited metal film | Leroy Grant, Iraj Shahvandi | 1994-10-25 |
| 5358901 | Process for forming an intermetallic layer | Stanley M. Filipiak, Johnson O. Olowolafe, Hisao Kawasaki | 1994-10-25 |