Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7323094 | Process for depositing a layer of material on a substrate | Matthew T. Herrick, Gregory S. Etherington, James D. Legg | 2008-01-29 |
| 6686282 | Plated metal transistor gate and method of formation | Hsing-Huang Tseng, Olubunmi O. Adetutu | 2004-02-03 |
| 6500324 | Process for depositing a layer of material on a substrate | Matthew T. Herrick, Gregory S. Etherington, James D. Legg | 2002-12-31 |
| 6316359 | Interconnect structure in a semiconductor device and method of formation | — | 2001-11-13 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Robert D. Mikkola, Matthew T. Herrick, Brett Baker, David Moralez Pena, Edward Acosta +4 more | 2001-10-02 |
| 6218302 | Method for forming a semiconductor device | Gregor Braeckelmann, Ramnath Venkatraman, Matthew T. Herrick, Robert W. Fiordalice, Dean J. Denning +2 more | 2001-04-17 |
| 6210781 | Method for photoselective seeding and metallization of three-dimensional materials | Thomas H. Baum, Luis J. Matienzo, Joseph E. Varsik | 2001-04-03 |
| 6197688 | Interconnect structure in a semiconductor device and method of formation | — | 2001-03-06 |
| 6194785 | Method for circuitizing through-holes by photo-activated seeding | Logan L. Simpson, Joseph E. Varsik | 2001-02-27 |
| 6174425 | Process for depositing a layer of material over a substrate | Matthew T. Herrick, Gregory S. Etherington, James D. Legg | 2001-01-16 |
| 6087258 | Method for circuitizing through-holes by photo-activated seeding | Logan L. Simpson, Joseph E. Varsik | 2000-07-11 |
| 6022596 | Method for photoselective seeding and metallization of three-dimensional materials | Thomas H. Baum, Luis J. Matienzo, Joseph E. Varsik | 2000-02-08 |
| 6017613 | Method for photoselective seeding and metallization of three-dimensional materials | Thomas H. Baum, Luis J. Matienzo, Joseph E. Varsik | 2000-01-25 |