Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171735 | Method for fabricating a semiconductor integrated circuit with a litho-etch, litho-etch process for etching trenches | Sohan S. Mehta, Norman Chen, Yuyang Sun, Shyam Sundar Pal, Jeong Soo Kim | 2015-10-27 |
| 9142451 | Reduced capacitance interlayer structures and fabrication methods | Sunil Kumar Singh, Teck Jung Tang, Dewei Xu | 2015-09-22 |
| 8173505 | Method of making a split gate memory cell | Ko-Min Chang, Gowrishankar L. Chindalore, Sung-Taeg Kang | 2012-05-08 |
| 7838363 | Method of forming a split gate non-volatile memory cell | Robert F. Steimle, Gowrishankar L. Chindalore | 2010-11-23 |
| 7745298 | Method of forming a via | Tab A. Stephens, Olubunmi O. Adetutu, Paul A. Grudowski | 2010-06-29 |
| 7416945 | Method for forming a split gate memory device | Ramachandran Muralidhar, Rajesh A. Rao, Narayanan C. Ramani, Robert F. Steimle | 2008-08-26 |
| 7323094 | Process for depositing a layer of material on a substrate | Cindy Reidsema Simpson, Gregory S. Etherington, James D. Legg | 2008-01-29 |
| 6566264 | Method for forming an opening in a semiconductor device substrate | Nigel G. Cave, Terry G. Sparks | 2003-05-20 |
| 6500324 | Process for depositing a layer of material on a substrate | Cindy Reidsema Simpson, Gregory S. Etherington, James D. Legg | 2002-12-31 |
| 6372665 | Method for forming a semiconductor device | Joy Watanabe, Terry G. Sparks, Nigel G. Cave | 2002-04-16 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Robert D. Mikkola, Brett Baker, David Moralez Pena, Edward Acosta +4 more | 2001-10-02 |
| 6232235 | Method of forming a semiconductor device | Nigel G. Cave, Terry G. Sparks | 2001-05-15 |
| 6218302 | Method for forming a semiconductor device | Gregor Braeckelmann, Ramnath Venkatraman, Cindy Reidsema Simpson, Robert W. Fiordalice, Dean J. Denning +2 more | 2001-04-17 |
| 6174425 | Process for depositing a layer of material over a substrate | Cindy Reidsema Simpson, Gregory S. Etherington, James D. Legg | 2001-01-16 |
| 6127258 | Method for forming a semiconductor device | Joy Watanabe, Terry G. Sparks, Nigel G. Cave | 2000-10-03 |