JW

Joy Watanabe

Motorola: 3 patents #3,303 of 12,470Top 30%
AT Adeia Semiconductor Bonding Technologies: 2 patents #25 of 46Top 55%
IT Invensas Bonding Technologies: 1 patents #17 of 21Top 85%
Overall (All Time): #778,897 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12272677 Direct bonded stack structures for increased reliability and improved yield in microelectronics Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more 2025-04-08
11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more 2024-04-09
11296053 Direct bonded stack structures for increased reliability and improved yield in microelectronics Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more 2022-04-05
6372665 Method for forming a semiconductor device Matthew T. Herrick, Terry G. Sparks, Nigel G. Cave 2002-04-16
6127258 Method for forming a semiconductor device Matthew T. Herrick, Terry G. Sparks, Nigel G. Cave 2000-10-03
6043146 Process for forming a semiconductor device John Stankus 2000-03-28