Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Robert D. Mikkola, Matthew T. Herrick, Brett Baker, Edward Acosta +4 more | 2001-10-02 |