Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11378511 | Methods and apparatus for detecting corrosion of conductive objects | Gang Peng, David Alexander BRITZ, Lance A. Scudder, David W. Groechel | 2022-07-05 |
| 8506788 | Leveler compounds | Deyan Wang, George G. Barclay | 2013-08-13 |
| 8262891 | Leveler compounds | Deyan Wang, George G. Barclay | 2012-09-11 |
| 7662981 | Leveler compounds | Deyan Wang, Chunyi Wu, George G. Barclay | 2010-02-16 |
| 7510639 | Leveler compounds | Deyan Wang, Chunyi Wu, George G. Barclay | 2009-03-31 |
| 7144488 | Electrode, electrochemical cell, and method for analysis of electroplating baths | Robert A. Binstead, Osnat Younes-Metzler, David A. Valeri | 2006-12-05 |
| 7128822 | Leveler compounds | Deyan Wang, Chunyi Wu | 2006-10-31 |
| 6797146 | Seed layer repair | Denis Morrissey, Jeffrey M. Calvert | 2004-09-28 |
| 6679983 | Method of electrodepositing copper | Denis Morrissey, Jeffrey M. Calvert | 2004-01-20 |
| 6649038 | Electroplating method | Jeffrey M. Calvert, Denis Morrissey | 2003-11-18 |
| 6297155 | Method for forming a copper layer over a semiconductor wafer | Cindy Reidsema Simpson, Matthew T. Herrick, Brett Baker, David Moralez Pena, Edward Acosta +4 more | 2001-10-02 |