Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327738 | Integrated semiconductor part cleaning system | Jenn C. Chow, Tuochuan Huang, Dorothea Buechel-Rimmel, Han-Wei Wang, Li Wu +1 more | 2025-06-10 |
| 12318868 | Texturizing a surface without bead blasting | Gang Peng, Jenn C. Chow, Tuochuan Huang, Han-Wei Wang | 2025-06-03 |
| 12131934 | Semiconductor substrate support leveling apparatus | Katherine Woo, Paul Brillhart, Jian Li, Shinnosuke Kawaguchi, Dorothea Buechel-Rimmel +4 more | 2024-10-29 |
| 11848218 | Semiconductor chamber component cleaning systems | Katty Marie Lydia Gamon Guyomard, Chidambara A. Ramalingam, Shawyon Jafari, Palash Joshi, Moin Ahmed Khan +5 more | 2023-12-19 |
| 11776822 | Wet cleaning of electrostatic chuck | Tuochuan Huang, Gang Peng, Vijay D. Parkhe, Shinnosuke Kawaguchi, David Benjaminson | 2023-10-03 |
| 11710647 | Hyperbaric clean method and apparatus for cleaning semiconductor chamber components | Richard W. Plavidal, Scott Osterman, Gang Peng, John Z. Smith | 2023-07-25 |
| 11661652 | Wet cleaning inside of gasline of semiconductor process equipment | Gang Peng, Halbert Chong, Marcus Pereira | 2023-05-30 |
| 11519071 | Method for fabricating chamber parts | Gang Peng, Han-Wei Wang | 2022-12-06 |
| 11378511 | Methods and apparatus for detecting corrosion of conductive objects | Gang Peng, Robert D. Mikkola, David Alexander BRITZ, Lance A. Scudder | 2022-07-05 |
| 11261533 | Aluminum plating at low temperature with high efficiency | Gang Peng, Robert Mikkola | 2022-03-01 |
| 10857625 | Texturizing a surface without bead blasting | Gang Peng, Jenn C. Chow, Tuochuan Huang, Han-Wei Wang | 2020-12-08 |
| 10434604 | Texturizing a surface without bead blasting | Gang Peng, Jenn C. Chow, Tuochuan Huang, Han-Wei Wang | 2019-10-08 |
| 7048607 | System and method for chemical mechanical planarization | Li-Wei Wu, Sourabh Mishra, Young Jeen Paik, Satyasrayan Kumaraswamy, Robert Lum +1 more | 2006-05-23 |
| 6623596 | Plasma reactor having an inductive antenna coupling power through a parallel plate electrode | Kenneth S. Collins, Michael R. Rice, John Trow, Douglas A. Buchberger, Jr., Eric Askarinam +2 more | 2003-09-23 |
| 6545420 | Plasma reactor using inductive RF coupling, and processes | Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jerry Wong +6 more | 2003-04-08 |
| 6524432 | Parallel-plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density | Kenneth S. Collins, Michael R. Rice, John Trow, Douglas A. Buchberger, Jr., Eric Askarinam +2 more | 2003-02-25 |
| 6518195 | Plasma reactor using inductive RF coupling, and processes | Kenneth S. Collins, Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick +7 more | 2003-02-11 |
| 6488807 | Magnetic confinement in a plasma reactor having an RF bias electrode | Kenneth S. Collins, Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick +7 more | 2002-12-03 |
| 6468136 | Tungsten CMP with improved alignment mark integrity, reduced edge residue, and reduced retainer ring notching | Robert Lum, Li Wu, Chiu Chan | 2002-10-22 |
| 6444137 | Method for processing substrates using gaseous silicon scavenger | Kenneth S. Collins, Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick | 2002-09-03 |
| 6440866 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, Gerald Yin, Jon Mohn, Craig A. Roderick +5 more | 2002-08-27 |
| 6399514 | High temperature silicon surface providing high selectivity in an oxide etch process | Jeffrey Marks, Jerry Wong, Peter Keswick, Chan-Lon Yang | 2002-06-04 |
| 6251792 | Plasma etch processes | Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jerry Wong +7 more | 2001-06-26 |
| 6238588 | High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process | Kenneth S. Collins, Raymond Hung, Michael R. Rice, Gerald Yin, Jian Ding +1 more | 2001-05-29 |
| 6218312 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, Gerald Yin, Jon Mohn, Craig A. Roderick +5 more | 2001-04-17 |