Issued Patents All Time
Showing 25 most recent of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080570 | Semiconductor processing system | Heng Tao | 2024-09-03 |
| 11189496 | Plasma reactor for ultra-high aspect ratio etching and etching method thereof | Yichuan Zhang, Jie Liang, Xingcai Su, Tuqiang Ni | 2021-11-30 |
| 9947562 | Method and apparatus for processing semiconductor work pieces | Aihua Chen, Ryoji Todaka | 2018-04-17 |
| 9230781 | Capacitive-coupled plasma processing apparatus and method for processing substrate | Zhongdu Liu | 2016-01-05 |
| 9208998 | Multi-station decoupled reactive ion etch chamber | Tuqiang Ni, Jinyuan Chen, Xueyu Qian | 2015-12-08 |
| 8366829 | Multi-station decoupled reactive ion etch chamber | Tuqiang Ni, Jinyuan Chen, Xueyu Qian | 2013-02-05 |
| 8336488 | Multi-station plasma reactor with multiple plasma regions | Aihua Chen, Yijun Liu, Jinyuan Chen, Lee Luo, Tuqiang Ni +1 more | 2012-12-25 |
| 8297225 | Capacitive CVD reactor and methods for plasma CVD process | Jinyuan Chen, Tuqiang Ni | 2012-10-30 |
| 7658800 | Gas distribution assembly for use in a semiconductor work piece processing reactor | Aihua Chen, Shulin Wang, Henry Ho, Qing Lv, Li Fu | 2010-02-09 |
| 7503996 | Multiple frequency plasma chamber, switchable RF system, and processes using same | Jinyuan Chen, Xueyu Qian, Tuqiang Ni, Hiroshi Iizuka | 2009-03-17 |
| 7227244 | Integrated low k dielectrics and etch stops | Claes Bjorkman, Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2007-06-05 |
| 7030335 | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao +3 more | 2006-04-18 |
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy-Yuan Shieh, Jennifer Y. Sun, Senh Thach +2 more | 2005-09-27 |
| 6858153 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2005-02-22 |
| 6849193 | Highly selective process for etching oxide over nitride using hexafluorobutadiene | Hoiman Hung, Joseph P. Caulfield, Hongqing Shan, Ruiping Wang | 2005-02-01 |
| 6838635 | Plasma reactor with overhead RF electrode tuned to the plasma | Daniel J. Hoffman | 2005-01-04 |
| 6793835 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Lee Luo, Claes Bjorkman, Brian Sy-Yuan Shieh | 2004-09-21 |
| 6699399 | Self-cleaning etch process | Xue-Yu Qian, Zhi-Wen Sun, Weinan Jiang, Arthur Y. Chen, Ming-Hsun Yang +5 more | 2004-03-02 |
| 6669858 | Integrated low k dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2003-12-30 |
| 6613691 | Highly selective oxide etch process using hexafluorobutadiene | Raymond Hung, Joseph P. Caulfield, Hongching Shan, Ruiping Wang | 2003-09-02 |
| 6602434 | Process for etching oxide using hexafluorobutadiene or related fluorocarbons and manifesting a wide process window | Hoiman Hung, Joseph P. Caulfield, Hongqing Shan, Ruiping Wang | 2003-08-05 |
| 6528751 | Plasma reactor with overhead RF electrode tuned to the plasma | Daniel J. Hoffman | 2003-03-04 |
| 6518195 | Plasma reactor using inductive RF coupling, and processes | Kenneth S. Collins, Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick +7 more | 2003-02-11 |
| 6503367 | Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma | Peter Loewenhardt, Philip M. Salzman | 2003-01-07 |
| 6500357 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Lee Luo, Claes Bjorkman, Brian Sy-Yuan Shieh | 2002-12-31 |