| D1094318 |
Cooling container for computing devices |
Xiaogang Sun, Nan Li, Shishuang He, Guanchao Zhao, Zonghai Chen +2 more |
2025-09-23 |
| 8828248 |
Method for defect reduction in magnetic write head fabrication |
Guomin Mao, Satyanarayana Myneni, Aron Pentek |
2014-09-09 |
| 8231799 |
Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone |
Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more |
2012-07-31 |
| 8048806 |
Methods to avoid unstable plasma states during a process transition |
Michael Kutney, Daniel J. Hoffman, Gerardo Delgadino, Ezra Robert Gold, Ashok Sinha +2 more |
2011-11-01 |
| 7575007 |
Chamber recovery after opening barrier over copper |
Hairong Tang, Keiji Horioka, Jeremiah T. Pender |
2009-08-18 |
| 7541292 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones |
Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more |
2009-06-02 |
| 7540971 |
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content |
Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more |
2009-06-02 |
| 7435685 |
Method of forming a low-K dual damascene interconnect structure |
Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more |
2008-10-14 |
| 7431859 |
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation |
Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more |
2008-10-07 |
| 7413990 |
Method of fabricating a dual damascene interconnect structure |
Yan Ye, Hong Du |
2008-08-19 |
| 7309448 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material |
Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Yan Ye |
2007-12-18 |
| 7300597 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material |
Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Yan Ye |
2007-11-27 |
| 7256134 |
Selective etching of carbon-doped low-k dielectrics |
Yunsang Kim, Neungho Shin, Heeyeop Chae, Joey Chiu, Yan Ye +1 more |
2007-08-14 |
| 7186943 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more |
2007-03-06 |
| 7132369 |
Method of forming a low-K dual damascene interconnect structure |
Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more |
2006-11-07 |
| 7132618 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more |
2006-11-07 |
| 7115517 |
Method of fabricating a dual damascene interconnect structure |
Yan Ye, Hong Du |
2006-10-03 |
| 7030335 |
Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
Daniel J. Hoffman, Gerald Yin, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr. +3 more |
2006-04-18 |
| 6921727 |
Method for modifying dielectric characteristics of dielectric layers |
Kang-Lie Chiang, Mahmoud Dahimene, Yan Ye, Gerardo Delgadino, Hoiman Hung +2 more |
2005-07-26 |
| 6894245 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more |
2005-05-17 |
| 6677712 |
Gas distribution plate electrode for a plasma receptor |
Dan Katz, Douglas A. Buchberger, Jr., Yan Ye, Robert B. Hagen, Ananda H. Kumar +3 more |
2004-01-13 |
| 6586886 |
Gas distribution plate electrode for a plasma reactor |
Dan Katz, Douglas A. Buchberger, Jr., Yan Ye, Robert B. Hagen, Ananda H. Kumar +3 more |
2003-07-01 |
| 6153530 |
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion |
Yan Ye, Chang-Lin Hsieh, Xian-Can Deng, Wen-Chiang Tu, Chung-Fu Chu +1 more |
2000-11-28 |