Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1094318 | Cooling container for computing devices | Xiaogang Sun, Nan Li, Shishuang He, Guanchao Zhao, Zonghai Chen +2 more | 2025-09-23 |
| 8828248 | Method for defect reduction in magnetic write head fabrication | Guomin Mao, Satyanarayana Myneni, Aron Pentek | 2014-09-09 |
| 8231799 | Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone | Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2012-07-31 |
| 8048806 | Methods to avoid unstable plasma states during a process transition | Michael Kutney, Daniel J. Hoffman, Gerardo Delgadino, Ezra Robert Gold, Ashok Sinha +2 more | 2011-11-01 |
| 7575007 | Chamber recovery after opening barrier over copper | Hairong Tang, Keiji Horioka, Jeremiah T. Pender | 2009-08-18 |
| 7541292 | Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones | Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2009-06-02 |
| 7540971 | Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content | Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2009-06-02 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2008-10-14 |
| 7431859 | Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation | Kallol Bera, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2008-10-07 |
| 7413990 | Method of fabricating a dual damascene interconnect structure | Yan Ye, Hong Du | 2008-08-19 |
| 7309448 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Yan Ye | 2007-12-18 |
| 7300597 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Gerardo Delgadino, Yan Ye | 2007-11-27 |
| 7256134 | Selective etching of carbon-doped low-k dielectrics | Yunsang Kim, Neungho Shin, Heeyeop Chae, Joey Chiu, Yan Ye +1 more | 2007-08-14 |
| 7186943 | MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more | 2007-03-06 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2006-11-07 |
| 7132618 | MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more | 2006-11-07 |
| 7115517 | Method of fabricating a dual damascene interconnect structure | Yan Ye, Hong Du | 2006-10-03 |
| 7030335 | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Gerald Yin, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr. +3 more | 2006-04-18 |
| 6921727 | Method for modifying dielectric characteristics of dielectric layers | Kang-Lie Chiang, Mahmoud Dahimene, Yan Ye, Gerardo Delgadino, Hoiman Hung +2 more | 2005-07-26 |
| 6894245 | Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Daniel J. Hoffman, Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Kang-Lie Chiang +2 more | 2005-05-17 |
| 6677712 | Gas distribution plate electrode for a plasma receptor | Dan Katz, Douglas A. Buchberger, Jr., Yan Ye, Robert B. Hagen, Ananda H. Kumar +3 more | 2004-01-13 |
| 6586886 | Gas distribution plate electrode for a plasma reactor | Dan Katz, Douglas A. Buchberger, Jr., Yan Ye, Robert B. Hagen, Ananda H. Kumar +3 more | 2003-07-01 |
| 6153530 | Post-etch treatment of plasma-etched feature surfaces to prevent corrosion | Yan Ye, Chang-Lin Hsieh, Xian-Can Deng, Wen-Chiang Tu, Chung-Fu Chu +1 more | 2000-11-28 |