JC

Joey Chiu

Applied Materials: 3 patents #2,994 of 7,310Top 45%
Overall (All Time): #1,583,795 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7435685 Method of forming a low-K dual damascene interconnect structure Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more 2008-10-14
7256134 Selective etching of carbon-doped low-k dielectrics Yunsang Kim, Neungho Shin, Heeyeop Chae, Yan Ye, Fang Tian +1 more 2007-08-14
7132369 Method of forming a low-K dual damascene interconnect structure Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more 2006-11-07