Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594400 | Multi zone gas injection upper electrode system | Ryan Bise, Rajinder Dhindsa, Alexei Marakhtanov, Lumin Li, Sang Ki Nam +6 more | 2023-02-28 |
| 10622195 | Multi zone gas injection upper electrode system | Ryan Bise, Rajinder Dhindsa, Alexei Marakhtanov, Lumin Li, Sang Ki Nam +6 more | 2020-04-14 |
| 10134600 | Dielectric contact etch | Leonid Romm, Alan J. Jensen, Xin Zhang | 2018-11-20 |
| 10079154 | Atomic layer etching of silicon nitride | Daniel Le | 2018-09-18 |
| 9779956 | Hydrogen activated atomic layer etching | Xin Zhang, Alan J. Jensen, Daniel Le | 2017-10-03 |
| 9515156 | Air gap spacer integration for improved fin device performance | Paul R. Besser, Bart J. van Schravendijk, Yoshie Kimura, Harald Orkorn-Schmidt, Dengliang Yang | 2016-12-06 |
| 9396961 | Integrated etch/clean for dielectric etch applications | Reza Arghavani, Shashank Deshmukh, Eric A. Hudson, Tom A. Kamp, Samantha Tan | 2016-07-19 |
| 9263240 | Dual zone temperature control of upper electrodes | Alexei Marakhtanov, Rajinder Dhindsa, Ryan Bise, Lumin Li, Sang Ki Nam +5 more | 2016-02-16 |
| 9040430 | Method of stripping organic mask with reduced damage to low-K film | John Nagarah | 2015-05-26 |
| 8652298 | Triode reactor design with multiple radiofrequency powers | Rajinder Dhindsa, Alexei Marakhtanov, Eric A. Hudson, Bi-Ming Yen, Andrew D. Bailey, III | 2014-02-18 |
| 8394722 | Bi-layer, tri-layer mask CD control | Robert C. Hefty | 2013-03-12 |
| 8236188 | Method for low-K dielectric etch with reduced damage | Bing Ji, Kenji Takeshita, Andrew D. Bailey, III, Eric A. Hudson, Maryam Moravej +6 more | 2012-08-07 |
| 8083963 | Removal of process residues on the backside of a substrate | Indrajit Lahiri, Teh-Tien Su, Sy-Yuan Brian Shieh, Ashok Sinha | 2011-12-27 |
| 8048806 | Methods to avoid unstable plasma states during a process transition | Michael Kutney, Daniel J. Hoffman, Ezra Robert Gold, Ashok Sinha, Xiaoye Zhao +2 more | 2011-11-01 |
| 7977245 | Methods for etching a dielectric barrier layer with high selectivity | Ying Xiao, Karsten Schneider | 2011-07-12 |
| 7828987 | Organic BARC etch process capable of use in the formation of low K dual damascene integrated circuits | Jens Schneider, Ying Xiao | 2010-11-09 |
| 7718543 | Two step etching of a bottom anti-reflective coating layer in dual damascene application | Zhilin Huang, Siyi Li | 2010-05-18 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia, Tzu-Fang Huang +6 more | 2008-10-14 |
| 7432209 | Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material | Richard Hagborg, Douglas A. Buchberger, Jr. | 2008-10-07 |
| 7309448 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Xiaoye Zhao, Yan Ye | 2007-12-18 |
| 7300597 | Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material | Hee Yeop Chae, Jeremiah T. Pender, Xiaoye Zhao, Yan Ye | 2007-11-27 |
| 7276447 | Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material | Indrajit Lahiri, Teh-Tien Su, Brian Sy-Yuan Sheih, Ashok Sinha | 2007-10-02 |
| 7244313 | Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination steps | Yifeng Zhou, Chang-Lin Hsieh | 2007-07-17 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia, Tzu-Fang Huang +6 more | 2006-11-07 |
| 6921727 | Method for modifying dielectric characteristics of dielectric layers | Kang-Lie Chiang, Mahmoud Dahimene, Xiaoye Zhao, Yan Ye, Hoiman Hung +2 more | 2005-07-26 |