Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288704 | Methods and apparatus for processing a substrate | Ralph P. ANTONIO, Lee Guan Tay, Peter Lai, Sudhir Gondhalekar, Jeffrey C. Hudgens | 2025-04-29 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more | 2014-06-17 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more | 2012-03-06 |
| 7700486 | Oxide-like seasoning for dielectric low k films | Sohyun Park, Wen Zhu, Li-Qun Xia, Hichem M'Saad | 2010-04-20 |
| 7588803 | Multi step ebeam process for modifying dielectric materials | Alexandros T. Demos, Li-Qun Xia, Wen Zhu | 2009-09-15 |
| 7459404 | Adhesion improvement for low k dielectrics | Lihua Li, Li-Qun Xia, Peter Wai-Man Lee, Hichem M'Saad, Zhenjiang Cui +2 more | 2008-12-02 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2008-10-14 |
| 7160821 | Method of depositing low k films | Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2007-01-09 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2006-11-07 |
| 7115508 | Oxide-like seasoning for dielectric low k films | Sohyun Park, Wen Zhu, Li-Qun Xia, Hichem M'Saad | 2006-10-03 |
| 7049249 | Method of improving stability in low k barrier layers | Lihua Li, Li-Qun Xia | 2006-05-23 |
| 7030041 | Adhesion improvement for low k dielectrics | Lihua Li, Li-Qun Xia, Peter Wai-Man Lee, Hichem M'Saad, Zhenjiang Cui +2 more | 2006-04-18 |
| 6936309 | Hardness improvement of silicon carboxy films | Lihua Li, Li-Qun Xia, Ellie Yieh | 2005-08-30 |
| 6914014 | Method for curing low dielectric constant film using direct current bias | Lihua Li, Li-Qun Xia, Juan Carlos Rocha-Alvarez, Maosheng Zhao | 2005-07-05 |
| 6911403 | Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics | Lihua Li, Tsutomu Tanaka, Li-Qun Xia, Dian Sugiarto, Visweswaren Sivaramakrishnan +2 more | 2005-06-28 |
| 6815373 | Use of cyclic siloxanes for hardness improvement of low k dielectric films | Vinita Singh, Srinivas D. Nemani, Yi Zheng, Lihua Li, Li-Qun Xia +1 more | 2004-11-09 |
| 6806207 | Method of depositing low K films | Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2004-10-19 |
| 6790788 | Method of improving stability in low k barrier layers | Lihua Li, Li-Qun Xia | 2004-09-14 |
| 6699784 | Method for depositing a low k dielectric film (K>3.5) for hard mask application | Li-Qun Xia, Ping Xu, Louis Yang, Wen Zhu | 2004-03-02 |
| 6632735 | Method of depositing low dielectric constant carbon doped silicon oxide | Wai-Fan Yau, Ju-Hyung Lee, Nasreen Chopra, David Cheung, Farhad Moghadam +5 more | 2003-10-14 |
| 6593247 | Method of depositing low k films using an oxidizing plasma | Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2003-07-15 |