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Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) |
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Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) |
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2008-12-16 |
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Adhesion improvement for low k dielectrics |
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2008-12-02 |
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2007-01-02 |
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CVD plasma assisted lower dielectric constant SICOH film |
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Method of depositing dielectric films |
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Adhesion improvement for low k dielectrics |
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2006-03-07 |
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Method of depositing dielectric films |
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CVD plasma assisted lower dielectric constant SICOH film |
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2005-09-13 |
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Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics |
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Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide |
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2005-01-04 |
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Damascene structure fabricated using a layer of silicon-based photoresist material |
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2004-11-30 |
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Method of depositing dielectric films |
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Method of depositing low dielectric constant carbon doped silicon oxide |
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Process for depositing and developing a plasma polymerized organosilicon photoresist film |
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2002-11-26 |
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Apparatus for depositing high deposition rate halogen-doped silicon oxide layer |
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2002-05-28 |
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Method for using bypass lines to stabilize gas flow and maintain plasma inside a deposition chamber |
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Process for depositing a plasma polymerized organosilicon photoresist film |
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2000-07-18 |
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Process for depositing high deposition rate halogen-doped silicon oxide layer |
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Method and apparatus for depositing deep UV photoresist films |
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