Issued Patents All Time
Showing 25 most recent of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262559 | Monolithic complementary field-effect transistors having carbon-doped release layers | Andrew Cockburn, Vanessa Pena, Daniel Philippe Cellier, John Tolle, Thomas Kirschenheiter +3 more | 2025-03-25 |
| 12046508 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Martin Jay Seamons +2 more | 2024-07-23 |
| 12002705 | Methods and apparatus for forming backside power rails | He Ren, Houssam Lazkani, Raman Gaire, Kuan-Ting Liu | 2024-06-04 |
| 11990368 | Doped selective metal caps to improve copper electromigration with ruthenium liner | Zhiyuan Wu | 2024-05-21 |
| 11965236 | Method of forming nickel silicide materials | Minrui Yu, He Ren | 2024-04-23 |
| 11967527 | Fully aligned subtractive processes and electronic devices therefrom | He Ren, Hao Jiang | 2024-04-23 |
| 11955382 | Reverse selective etch stop layer | Kevin Kashefi, Alexander Jansen, He Ren, Lu Chen, Feng Chen | 2024-04-09 |
| 11923244 | Subtractive metals and subtractive metal semiconductor structures | He Ren, Hao Jiang, Shi YOU | 2024-03-05 |
| 11908696 | Methods and devices for subtractive self-alignment | He Ren, Hao Jiang, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2024-02-20 |
| 11830725 | Method of cleaning a structure and method of depositing a capping layer in a structure | Naomi Yoshida, He Ren, Hao Jiang, Chenfei Shen, Chi-Chou Lin +2 more | 2023-11-28 |
| 11776806 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2023-10-03 |
| 11749532 | Methods and apparatus for processing a substrate | Hao Jiang, Chi-Pin Lu, He Ren | 2023-09-05 |
| 11705366 | Methods for controllable metal and barrier-liner recess | He Ren, Amrita B. Mullick, Regina Freed, Uday Mitra | 2023-07-18 |
| 11626288 | Integrated contact silicide with tunable work functions | Raymond Hung, Michael Haverty | 2023-04-11 |
| 11615984 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Martin Jay Seamons +2 more | 2023-03-28 |
| 11508617 | Method of forming interconnect for semiconductor device | Hao Jiang, Chi-Pin Lu, He Ren, Chi-I Lang, Ho-yung David Hwang | 2022-11-22 |
| 11410885 | Fully aligned subtractive processes and electronic devices therefrom | He Ren, Hao Jiang | 2022-08-09 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11373903 | Doped selective metal caps to improve copper electromigration with ruthenium liner | Zhiyuan Wu | 2022-06-28 |
| 11289342 | Damage free metal conductor formation | He Ren, Jong Mun Kim, Maximillian Clemons, Minrui Yu, Chentsau Chris Ying | 2022-03-29 |
| 11257677 | Methods and devices for subtractive self-alignment | He Ren, Hao Jiang, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2022-02-22 |
| 11205589 | Methods and apparatuses for forming interconnection structures | He Ren, Hao Jiang, Srinivas D. Nemani, Ellie Yieh | 2021-12-21 |
| 11164780 | Process integration approach for selective metal via fill | Shi YOU, He Ren, Yi Xu, Feng Chen | 2021-11-02 |
| 11101174 | Gap fill deposition process | Hao Jiang, Nikolaos Bekiaris, Erica Chen | 2021-08-24 |
| 11094588 | Interconnection structure of selective deposition process | Shi YOU, He Ren | 2021-08-17 |