Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12201030 | Spin-orbit torque MRAM structure and manufacture thereof | Minrui Yu, Wenhui Wang, Jaesoo Ahn, Sahil Patel, Lin Xue +5 more | 2025-01-14 |
| 11723283 | Spin-orbit torque MRAM structure and manufacture thereof | Minrui Yu, Wenhui Wang, Jaesoo Ahn, Sahil Patel, Lin Xue +5 more | 2023-08-08 |
| 11384428 | Carbon layer covered mask in 3D applications | Mang-Mang Ling, Thomas Jongwan Kwon, Chentsau Chris Ying | 2022-07-12 |
| 11289342 | Damage free metal conductor formation | He Ren, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying | 2022-03-29 |
| 11145808 | Methods for etching a structure for MRAM applications | Minrui Yu, Chando Park, Mang-Mang Ling, Jaesoo Ahn, Chentsau Chris Ying +3 more | 2021-10-12 |
| 10964527 | Residual removal | Biao Liu, Cheng Pan, Erica Chen, Chentsau Ying, Srinivas D. Nemani +1 more | 2021-03-30 |
| 10957548 | Method of etching copper indium gallium selenide (CIGS) material | Mang-Mang Ling, Chentsau Chris Ying | 2021-03-23 |
| 10692734 | Methods of patterning nickel silicide layers on a semiconductor device | Chentsau Chris Ying, He Ren, Srinivas D. Nemani, Ellie Yieh | 2020-06-23 |
| 10685849 | Damage free metal conductor formation | He Ren, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying | 2020-06-16 |
| 10643854 | Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants | Daisuke Shimizu | 2020-05-05 |
| 9909213 | Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors | Sergio Fukuda Shoji, Hamid Noorbakhsh, Jason Della Rosa, Ajit Balakrishna | 2018-03-06 |
| 9748366 | Etching oxide-nitride stacks using C4F6H2 | Kenny L. Doan, Li Ling, Jairaj Payyapilly, Srinivas D. Nemani, Daisuke Shimizu +1 more | 2017-08-29 |
| 9589832 | Maintaining mask integrity to form openings in wafers | Daisuke Shimizu | 2017-03-07 |
| 9305804 | Plasma etch processes for opening mask layers | Jairaj Payyapilly | 2016-04-05 |
| 9299574 | Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants | Daisuke Shimizu | 2016-03-29 |
| 9269587 | Methods for etching materials using synchronized RF pulses | Daisuke Shimizu, Katsumasa Kawasaki, Sergio Fukuda Shoji | 2016-02-23 |
| 9129911 | Boron-doped carbon-based hardmask etch processing | Kenny L. Doan, Daisuke Shimizu | 2015-09-08 |
| 8778207 | Plasma etch processes for boron-doped carbonaceous mask layers | Jairaj Payyapilly, Kenny L. Doan | 2014-07-15 |
| 8668837 | Method for etching substrate | Kenny L. Doan | 2014-03-11 |
| 8603921 | Maintaining mask integrity to form openings in wafers | Daisuke Shimizu | 2013-12-10 |
| 8187415 | Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone | Jingbao Liu, Bryan Pu | 2012-05-29 |
| 7807064 | Halogen-free amorphous carbon mask etch having high selectivity to photoresist | Judy Wang, Ajey M. Joshi, Jingbao Liu, Bryan Pu | 2010-10-05 |