| 12201030 |
Spin-orbit torque MRAM structure and manufacture thereof |
Minrui Yu, Wenhui Wang, Jaesoo Ahn, Sahil Patel, Lin Xue +5 more |
2025-01-14 |
|
| 11723283 |
Spin-orbit torque MRAM structure and manufacture thereof |
Minrui Yu, Wenhui Wang, Jaesoo Ahn, Sahil Patel, Lin Xue +5 more |
2023-08-08 |
$46,911,000 |
| 11384428 |
Carbon layer covered mask in 3D applications |
Mang-Mang Ling, Thomas Jongwan Kwon, Chentsau Chris Ying |
2022-07-12 |
$30,931,000 |
| 11289342 |
Damage free metal conductor formation |
He Ren, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying |
2022-03-29 |
$46,373,000 |
| 11145808 |
Methods for etching a structure for MRAM applications |
Minrui Yu, Chando Park, Mang-Mang Ling, Jaesoo Ahn, Chentsau Chris Ying +3 more |
2021-10-12 |
$163,741,000 |
| 10964527 |
Residual removal |
Biao Liu, Cheng Pan, Erica Chen, Chentsau Ying, Srinivas D. Nemani +1 more |
2021-03-30 |
$120,425,000 |
| 10957548 |
Method of etching copper indium gallium selenide (CIGS) material |
Mang-Mang Ling, Chentsau Chris Ying |
2021-03-23 |
$48,969,000 |
| 10692734 |
Methods of patterning nickel silicide layers on a semiconductor device |
Chentsau Chris Ying, He Ren, Srinivas D. Nemani, Ellie Yieh |
2020-06-23 |
$29,749,000 |
| 10685849 |
Damage free metal conductor formation |
He Ren, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying |
2020-06-16 |
$36,933,000 |
| 10643854 |
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants |
Daisuke Shimizu |
2020-05-05 |
$58,379,000 |
| 9909213 |
Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors |
Sergio Fukuda Shoji, Hamid Noorbakhsh, Jason Della Rosa, Ajit Balakrishna |
2018-03-06 |
$32,877,000 |
| 9748366 |
Etching oxide-nitride stacks using C4F6H2 |
Kenny L. Doan, Li Ling, Jairaj Payyapilly, Srinivas D. Nemani, Daisuke Shimizu +1 more |
2017-08-29 |
$19,098,000 |
| 9589832 |
Maintaining mask integrity to form openings in wafers |
Daisuke Shimizu |
2017-03-07 |
$38,660,000 |
| 9305804 |
Plasma etch processes for opening mask layers |
Jairaj Payyapilly |
2016-04-05 |
$9,374,000 |
| 9299574 |
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants |
Daisuke Shimizu |
2016-03-29 |
$6,414,000 |
| 9269587 |
Methods for etching materials using synchronized RF pulses |
Daisuke Shimizu, Katsumasa Kawasaki, Sergio Fukuda Shoji |
2016-02-23 |
$9,765,000 |
| 9129911 |
Boron-doped carbon-based hardmask etch processing |
Kenny L. Doan, Daisuke Shimizu |
2015-09-08 |
$6,271,000 |
| 8778207 |
Plasma etch processes for boron-doped carbonaceous mask layers |
Jairaj Payyapilly, Kenny L. Doan |
2014-07-15 |
$20,143,000 |
| 8668837 |
Method for etching substrate |
Kenny L. Doan |
2014-03-11 |
$12,153,000 |
| 8603921 |
Maintaining mask integrity to form openings in wafers |
Daisuke Shimizu |
2013-12-10 |
$20,050,000 |
| 8187415 |
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone |
Jingbao Liu, Bryan Pu |
2012-05-29 |
$9,160,000 |
| 7807064 |
Halogen-free amorphous carbon mask etch having high selectivity to photoresist |
Judy Wang, Ajey M. Joshi, Jingbao Liu, Bryan Pu |
2010-10-05 |
$8,418,000 |
