Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12384185 | Methods, systems, and apparatus for inkjet printing self-assembled monoloayer (SAM) structures on substrates | Yingdong Luo, Rami Hourani, Xiaopei Deng, Kang Luo, Ludovic Godet | 2025-08-12 |
| 12288672 | Methods and apparatus for carbon compound film deposition | Qiwei Liang, Srinivas D. Nemani, Chentsau Chris Ying, Ellie Yieh, Nithin Thomas ALEX | 2025-04-29 |
| 12111572 | Methods of greytone imprint lithography to fabricate optical devices | Hao Tang, Kang Luo, Yongan Xu | 2024-10-08 |
| 11955333 | Methods and apparatus for processing a substrate | Jethro Tannos, Bhargav S. Citla, Srinivas D. Nemani, Ellie Yieh, Joshua Rubnitz +3 more | 2024-04-09 |
| 11735420 | Wafer treatment for achieving defect-free self-assembled monolayers | Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more | 2023-08-22 |
| 11709423 | Methods of greytone imprint lithography to fabricate optical devices | Hao Tang, Kang Luo, Yongan Xu | 2023-07-25 |
| 11682556 | Methods of improving graphene deposition for processes using microwave surface-wave plasma on dielectric materials | Jie Zhou, Qiwei Liang, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Yieh | 2023-06-20 |
| 11488856 | Methods for gapfill in high aspect ratio structures | Pramit Manna, Ludovic Godet, Rui Cheng, Ziqing Duan, Abhijit Basu Mallick +1 more | 2022-11-01 |
| 11289331 | Methods for graphene formation using microwave surface-wave plasma on dielectric materials | Jie Zhou, Qiwei Liang, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Yieh | 2022-03-29 |
| 11101174 | Gap fill deposition process | Hao Jiang, Nikolaos Bekiaris, Mehul Naik | 2021-08-24 |
| 11049731 | Methods for film modification | Chentsau Chris Ying, Bhargav S. Citla, Jethro Tannos, Matthew August Mattson | 2021-06-29 |
| 10964527 | Residual removal | Jong Mun Kim, Biao Liu, Cheng Pan, Chentsau Ying, Srinivas D. Nemani +1 more | 2021-03-30 |
| 10892161 | Enhanced selective deposition process | Biao Liu, Cheng Pan, Srinivas D. Nemani, Chang Ke, Lei Zhou | 2021-01-12 |
| 10811303 | Methods for gapfill in high aspect ratio structures | Pramit Manna, Ludovic Godet, Rui Cheng, Ziqing Duan, Abhijit Basu Mallick +1 more | 2020-10-20 |
| 10770292 | Wafer treatment for achieving defect-free self-assembled monolayers | Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more | 2020-09-08 |
| 10192775 | Methods for gapfill in high aspect ratio structures | Pramit Manna, Ludovic Godet, Rui Cheng, Ziqing Duan, Abhijit Basu Mallick +1 more | 2019-01-29 |
| 10096512 | Gapfill film modification for advanced CMP and recess flow | Ludovic Godet, Srinivas D. Nemani, Ellie Yieh | 2018-10-09 |
| 9777378 | Advanced process flow for high quality FCVD films | Srinivas D. Nemani, Ludovic Godet, Jun Xue, Ellie Yieh | 2017-10-03 |
| 9773675 | 3D material modification for advanced processing | Ludovic Godet, Srinivas D. Nemani, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-09-26 |
| 9620407 | 3D material modification for advanced processing | Ludovic Godet, Srinivas D. Nemani, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-04-11 |
| 9595467 | Air gap formation in interconnection structure by implantation process | Jun Xue, Ludovic Godet, Srinivas D. Nemani, Ellie Yieh | 2017-03-14 |