Issued Patents All Time
Showing 25 most recent of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12066846 | Device enclosure temperature control | Paul Rutherford, Jr., Adam Delaney Boyd, Donald Iain MacInnes | 2024-08-20 |
| 12062545 | Fluorine-free tungsten ALD for dielectric selectivity improvement | Ilanit Fisher, Chi-Chou Lin, Kedi Wu, Wen-Ting Chen, Shih Chung Chen +4 more | 2024-08-13 |
| 12046508 | Method of dielectric material fill and treatment | Shi YOU, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik, Martin Jay Seamons +2 more | 2024-07-23 |
| 12002705 | Methods and apparatus for forming backside power rails | Houssam Lazkani, Raman Gaire, Mehul Naik, Kuan-Ting Liu | 2024-06-04 |
| 11965236 | Method of forming nickel silicide materials | Minrui Yu, Mehul Naik | 2024-04-23 |
| 11967527 | Fully aligned subtractive processes and electronic devices therefrom | Hao Jiang, Mehul Naik | 2024-04-23 |
| 11955382 | Reverse selective etch stop layer | Kevin Kashefi, Alexander Jansen, Mehul Naik, Lu Chen, Feng Chen | 2024-04-09 |
| 11923244 | Subtractive metals and subtractive metal semiconductor structures | Hao Jiang, Shi YOU, Mehul Naik | 2024-03-05 |
| 11908696 | Methods and devices for subtractive self-alignment | Hao Jiang, Mehul Naik, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2024-02-20 |
| 11830725 | Method of cleaning a structure and method of depositing a capping layer in a structure | Naomi Yoshida, Hao Jiang, Chenfei Shen, Chi-Chou Lin, Hao Chen +2 more | 2023-11-28 |
| 11776806 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2023-10-03 |
| 11749532 | Methods and apparatus for processing a substrate | Hao Jiang, Chi-Pin Lu, Mehul Naik | 2023-09-05 |
| 11705366 | Methods for controllable metal and barrier-liner recess | Amrita B. Mullick, Regina Freed, Mehul Naik, Uday Mitra | 2023-07-18 |
| 11615984 | Method of dielectric material fill and treatment | Shi YOU, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik, Martin Jay Seamons +2 more | 2023-03-28 |
| 11515200 | Selective tungsten deposition within trench structures | Yi Xu, Yufei Hu, Yu Lei, Shi YOU, Kazuya Daito | 2022-11-29 |
| 11508617 | Method of forming interconnect for semiconductor device | Hao Jiang, Chi-Pin Lu, Chi-I Lang, Ho-yung David Hwang, Mehul Naik | 2022-11-22 |
| 11437274 | Fully self-aligned via | Regina Freed, Madhur Sachan, Susmit Singha Roy, Gabriela Alva, Ho-yung David Hwang +4 more | 2022-09-06 |
| 11410885 | Fully aligned subtractive processes and electronic devices therefrom | Hao Jiang, Mehul Naik | 2022-08-09 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |
| 11289342 | Damage free metal conductor formation | Jong Mun Kim, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying | 2022-03-29 |
| 11257677 | Methods and devices for subtractive self-alignment | Hao Jiang, Mehul Naik, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2022-02-22 |
| 11205589 | Methods and apparatuses for forming interconnection structures | Hao Jiang, Mehul Naik, Srinivas D. Nemani, Ellie Yieh | 2021-12-21 |
| 11164780 | Process integration approach for selective metal via fill | Shi YOU, Mehul Naik, Yi Xu, Feng Chen | 2021-11-02 |
| 11094588 | Interconnection structure of selective deposition process | Shi YOU, Mehul Naik | 2021-08-17 |