| 12066846 |
Device enclosure temperature control |
Paul Rutherford, Jr., Adam Delaney Boyd, Donald Iain MacInnes |
2024-08-20 |
$19,145,000 |
| 12062545 |
Fluorine-free tungsten ALD for dielectric selectivity improvement |
Ilanit Fisher, Chi-Chou Lin, Kedi Wu, Wen-Ting Chen, Shih Chung Chen +4 more |
2024-08-13 |
$69,975,000 |
| 12046508 |
Method of dielectric material fill and treatment |
Shi YOU, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik, Martin Jay Seamons +2 more |
2024-07-23 |
$84,339,000 |
| 12002705 |
Methods and apparatus for forming backside power rails |
Houssam Lazkani, Raman Gaire, Mehul Naik, Kuan-Ting Liu |
2024-06-04 |
$68,807,000 |
| 11965236 |
Method of forming nickel silicide materials |
Minrui Yu, Mehul Naik |
2024-04-23 |
$64,043,000 |
| 11967527 |
Fully aligned subtractive processes and electronic devices therefrom |
Hao Jiang, Mehul Naik |
2024-04-23 |
$64,043,000 |
| 11955382 |
Reverse selective etch stop layer |
Kevin Kashefi, Alexander Jansen, Mehul Naik, Lu Chen, Feng Chen |
2024-04-09 |
$47,694,000 |
| 11923244 |
Subtractive metals and subtractive metal semiconductor structures |
Hao Jiang, Shi YOU, Mehul Naik |
2024-03-05 |
$73,319,000 |
| 11908696 |
Methods and devices for subtractive self-alignment |
Hao Jiang, Mehul Naik, Wenting Hou, Jianxin Lei, Chen Gong +1 more |
2024-02-20 |
$66,055,000 |
| 11830725 |
Method of cleaning a structure and method of depositing a capping layer in a structure |
Naomi Yoshida, Hao Jiang, Chenfei Shen, Chi-Chou Lin, Hao Chen +2 more |
2023-11-28 |
$39,424,000 |
| 11776806 |
Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more |
2023-10-03 |
$34,462,000 |
| 11749532 |
Methods and apparatus for processing a substrate |
Hao Jiang, Chi-Pin Lu, Mehul Naik |
2023-09-05 |
$42,922,000 |
| 11705366 |
Methods for controllable metal and barrier-liner recess |
Amrita B. Mullick, Regina Freed, Mehul Naik, Uday Mitra |
2023-07-18 |
|
| 11615984 |
Method of dielectric material fill and treatment |
Shi YOU, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik, Martin Jay Seamons +2 more |
2023-03-28 |
$69,791,000 |
| 11515200 |
Selective tungsten deposition within trench structures |
Yi Xu, Yufei Hu, Yu Lei, Shi YOU, Kazuya Daito |
2022-11-29 |
$23,914,000 |
| 11508617 |
Method of forming interconnect for semiconductor device |
Hao Jiang, Chi-Pin Lu, Chi-I Lang, Ho-yung David Hwang, Mehul Naik |
2022-11-22 |
$48,755,000 |
| 11437274 |
Fully self-aligned via |
Regina Freed, Madhur Sachan, Susmit Singha Roy, Gabriela Alva, Ho-yung David Hwang +4 more |
2022-09-06 |
|
| 11410885 |
Fully aligned subtractive processes and electronic devices therefrom |
Hao Jiang, Mehul Naik |
2022-08-09 |
$67,965,000 |
| 11380536 |
Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more |
2022-07-05 |
$35,888,000 |
| 11355391 |
Method for forming a metal gapfill |
Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more |
2022-06-07 |
$46,649,000 |
| 11289342 |
Damage free metal conductor formation |
Jong Mun Kim, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying |
2022-03-29 |
$46,373,000 |
| 11257677 |
Methods and devices for subtractive self-alignment |
Hao Jiang, Mehul Naik, Wenting Hou, Jianxin Lei, Chen Gong +1 more |
2022-02-22 |
$169,194,000 |
| 11205589 |
Methods and apparatuses for forming interconnection structures |
Hao Jiang, Mehul Naik, Srinivas D. Nemani, Ellie Yieh |
2021-12-21 |
$167,553,000 |
| 11164780 |
Process integration approach for selective metal via fill |
Shi YOU, Mehul Naik, Yi Xu, Feng Chen |
2021-11-02 |
$95,673,000 |
| 11094588 |
Interconnection structure of selective deposition process |
Shi YOU, Mehul Naik |
2021-08-17 |
$63,158,000 |
