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Gap fill methods using catalyzed deposition |
Byunghoon Yoon, Liqi Wu, Joung Joo Lee, Xi Cen, Wei-Sheng Lei +2 more |
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Process chamber pumping liner |
Yang Li, Xi Cen, Min-Han Lee, Mehran Behdjat |
2025-03-11 |
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| 12191198 |
Low resistivity tungsten film and method of manufacture |
Feihu Wang, Joung Joo Lee, Xi Cen, Zhibo Yuan, Wei-Sheng Lei +2 more |
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Tungsten molybdenum structures |
Xi Cen, Dixiong WANG, Yi Luo |
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Formation of metal vias on metal lines |
Ryan Smith, Nicolas L. Breil |
2024-10-08 |
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Methods for low resistivity and stress tungsten gap fill |
Xi Cen, Min Heon, Wei Min Chan, Tom Ho Wing Yu, Peiqi WANG +4 more |
2024-09-17 |
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Methods for forming low resistivity tungsten features |
Peiqi WANG, Cheng-Liang Cheng, Insu HA, Sang Jin Lee |
2024-07-16 |
$116,305,000 |
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Tungsten gapfill using molybdenum co-flow |
Xi Cen |
2024-06-18 |
$83,264,000 |
| 11859277 |
Catalyst enhanced molybdenum deposition and gap fill |
Xi Cen, Seshadri Ganguli, Xinming Zhang, Norman L. Tam, Abhilash J. Mayur |
2024-01-02 |
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Methods and apparatus for low resistivity and stress tungsten gap fill |
Xi Cen, Min Heon, Wei Min Chan, Tom Ho Wing Yu, Peiqi WANG +4 more |
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Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Avgerinos V. Gelatos, David T. Or +8 more |
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Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Avgerinos V. Gelatos, David T. Or +8 more |
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Method for forming a metal gapfill |
Xi Cen, Feiyue Ma, Yu Lei, Kazuya Daito, Yi Xu +13 more |
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Methods of reducing or eliminating defects in tungsten film |
Guoqiang Jian, Wei V. Tang, Chi-Chou Lin, Paul F. Ma, Vikash Banthia +4 more |
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Process integration approach of selective tungsten via fill |
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In-situ pre-clean for selectivity improvement for selective deposition |
Vikash Banthia, Sang Ho Yu, Mei Chang, Feiyue Ma |
2019-08-27 |
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Process integration approach of selective tungsten via fill |
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Methods for forming low-resistance contacts through integrated process flow systems |
Yu Lei, Vikash Banthia, Xinyu Fu, Yi Xu, Kazuya Daito +9 more |
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Apparatus for variable substrate temperature control |
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Tungsten deposition with tungsten hexafluoride (WF6) etchback |
Sang Ho Yu |
2017-08-29 |
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Methods for forming metal organic tungsten for middle of the line (MOL) applications |
Liqi Wu, Sang Ho Yu, Kazuya Daito, Kie Jin Park, David Thompson |
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Cobalt removal for chamber clean or pre-clean process |
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Tungsten growth modulation by controlling surface composition |
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Boron ionization for aluminum oxide etch enhancement |
Sang Ho Yu, Kie Jin Park, Glen T. Mori, Joshua Collins |
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Methods and apparatus for thermal based substrate processing with variable temperature capability |
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