Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293902 | Process kit for a substrate support | Muhannad Mustafa, Muhammad M. Rasheed, Yu Lei, Avgerinos V. Gelatos, Victor H Calderon +3 more | 2025-05-06 |
| 11421322 | Blocker plate for use in a substrate process chamber | Xiaoxiong Yuan, Yu Lei, Yi Xu, Kazuya Daito, Pingyan Lei +2 more | 2022-08-23 |
| 11387134 | Process kit for a substrate support | Muhannad Mustafa, Muhammad M. Rasheed, Yu Lei, Avgerinos V. Gelatos, Victor H Calderon +3 more | 2022-07-12 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |
| 11249386 | Extreme ultraviolet mask with backside coating | Vibhu Jindal, Madhavi R. Chandrachood | 2022-02-15 |
| 10879081 | Methods of reducing or eliminating defects in tungsten film | Guoqiang Jian, Wei V. Tang, Chi-Chou Lin, Paul F. Ma, Kai Wu +4 more | 2020-12-29 |
| 10727119 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik +2 more | 2020-07-28 |
| 10704147 | Process kit design for in-chamber heater and wafer rotating mechanism | Muhammad M. Rasheed, Muhannad Mustafa, Hamid Tavassoli, Steven V. Sansoni, Cheng-Hsiung Tsai | 2020-07-07 |
| 10535527 | Methods for depositing semiconductor films | Yi Xu, Takashi Kuratomi, Avgerinos V. Gelatos, Mei Chang, Kazuya Daito | 2020-01-14 |
| 10508339 | Blocker plate for use in a substrate process chamber | Xiaoxiong Yuan, Yu Lei, Yi Xu, Kazuya Daito, Pingyan Lei +2 more | 2019-12-17 |
| 10395916 | In-situ pre-clean for selectivity improvement for selective deposition | Kai Wu, Sang Ho Yu, Mei Chang, Feiyue Ma | 2019-08-27 |
| 10256144 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik +2 more | 2019-04-09 |
| 10256076 | Substrate processing apparatus and methods | Shi Wei Toh, Avgerinos V. Gelatos | 2019-04-09 |
| 9947578 | Methods for forming low-resistance contacts through integrated process flow systems | Yu Lei, Kai Wu, Xinyu Fu, Yi Xu, Kazuya Daito +9 more | 2018-04-17 |
| 9595466 | Methods for etching via atomic layer deposition (ALD) cycles | Xinyu Fu, Srinivas Gandikota, Mei Chang, Seshadri Ganguli, Guoqiang Jian +2 more | 2017-03-14 |
| 7939422 | Methods of thin film process | Nitin K. Ingle, Jing Tang, Yi Zheng, Zheng Yuan, Zhenbin Ge +4 more | 2011-05-10 |
| 7642171 | Multi-step anneal of thin films for film densification and improved gap-fill | Nitin K. Ingle, Zheng Yuan, Xinyun Xia, Hali Forstner, Rong Pan | 2010-01-05 |
| 7456116 | Gap-fill depositions in the formation of silicon containing dielectric materials | Nitin K. Ingle, Shan Wong, Xinyun Xia, Won Bae Bang, Yen-Kun Wang +1 more | 2008-11-25 |
| 7335609 | Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materials | Nitin K. Ingle, Shan Wong, Xinyun Xia, Won Bae Bang, Yen-Kun Wang | 2008-02-26 |
| 6843882 | Gas flow control in a wafer processing system having multiple chambers for performing same process | Karthik Janakiraman, Victor Wang, Teresa Winson, Nitin K. Ingle | 2005-01-18 |