| 12293902 |
Process kit for a substrate support |
Muhannad Mustafa, Muhammad M. Rasheed, Yu Lei, Avgerinos V. Gelatos, Victor H Calderon +3 more |
2025-05-06 |
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| 11421322 |
Blocker plate for use in a substrate process chamber |
Xiaoxiong Yuan, Yu Lei, Yi Xu, Kazuya Daito, Pingyan Lei +2 more |
2022-08-23 |
$37,610,000 |
| 11387134 |
Process kit for a substrate support |
Muhannad Mustafa, Muhammad M. Rasheed, Yu Lei, Avgerinos V. Gelatos, Victor H Calderon +3 more |
2022-07-12 |
$30,931,000 |
| 11355391 |
Method for forming a metal gapfill |
Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more |
2022-06-07 |
$46,649,000 |
| 11249386 |
Extreme ultraviolet mask with backside coating |
Vibhu Jindal, Madhavi R. Chandrachood |
2022-02-15 |
$65,265,000 |
| 10879081 |
Methods of reducing or eliminating defects in tungsten film |
Guoqiang Jian, Wei V. Tang, Chi-Chou Lin, Paul F. Ma, Kai Wu +4 more |
2020-12-29 |
$47,583,000 |
| 10727119 |
Process integration approach of selective tungsten via fill |
He Ren, Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik +2 more |
2020-07-28 |
$35,855,000 |
| 10704147 |
Process kit design for in-chamber heater and wafer rotating mechanism |
Muhammad M. Rasheed, Muhannad Mustafa, Hamid Tavassoli, Steven V. Sansoni, Cheng-Hsiung Tsai |
2020-07-07 |
$29,619,000 |
| 10535527 |
Methods for depositing semiconductor films |
Yi Xu, Takashi Kuratomi, Avgerinos V. Gelatos, Mei Chang, Kazuya Daito |
2020-01-14 |
$50,821,000 |
| 10508339 |
Blocker plate for use in a substrate process chamber |
Xiaoxiong Yuan, Yu Lei, Yi Xu, Kazuya Daito, Pingyan Lei +2 more |
2019-12-17 |
$25,541,000 |
| 10395916 |
In-situ pre-clean for selectivity improvement for selective deposition |
Kai Wu, Sang Ho Yu, Mei Chang, Feiyue Ma |
2019-08-27 |
$34,720,000 |
| 10256144 |
Process integration approach of selective tungsten via fill |
He Ren, Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik +2 more |
2019-04-09 |
$19,096,000 |
| 10256076 |
Substrate processing apparatus and methods |
Shi Wei Toh, Avgerinos V. Gelatos |
2019-04-09 |
$19,096,000 |
| 9947578 |
Methods for forming low-resistance contacts through integrated process flow systems |
Yu Lei, Kai Wu, Xinyu Fu, Yi Xu, Kazuya Daito +9 more |
2018-04-17 |
$32,881,000 |
| 9595466 |
Methods for etching via atomic layer deposition (ALD) cycles |
Xinyu Fu, Srinivas Gandikota, Mei Chang, Seshadri Ganguli, Guoqiang Jian +2 more |
2017-03-14 |
$16,778,000 |
| 7939422 |
Methods of thin film process |
Nitin K. Ingle, Jing Tang, Yi Zheng, Zheng Yuan, Zhenbin Ge +4 more |
2011-05-10 |
$30,042,000 |
| 7642171 |
Multi-step anneal of thin films for film densification and improved gap-fill |
Nitin K. Ingle, Zheng Yuan, Xinyun Xia, Hali Forstner, Rong Pan |
2010-01-05 |
$23,823,000 |
| 7456116 |
Gap-fill depositions in the formation of silicon containing dielectric materials |
Nitin K. Ingle, Shan Wong, Xinyun Xia, Won Bae Bang, Yen-Kun Wang +1 more |
2008-11-25 |
$22,144,000 |
| 7335609 |
Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materials |
Nitin K. Ingle, Shan Wong, Xinyun Xia, Won Bae Bang, Yen-Kun Wang |
2008-02-26 |
$21,345,000 |
| 6843882 |
Gas flow control in a wafer processing system having multiple chambers for performing same process |
Karthik Janakiraman, Victor Wang, Teresa Winson, Nitin K. Ingle |
2005-01-18 |
$25,041,000 |
