Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315760 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2022-04-26 |
| 10704147 | Process kit design for in-chamber heater and wafer rotating mechanism | Muhammad M. Rasheed, Muhannad Mustafa, Steven V. Sansoni, Cheng-Hsiung Tsai, Vikash Banthia | 2020-07-07 |
| 10697057 | Collimator for use in a physical vapor deposition chamber | Goichi Yoshidome, Keith A. Miller, Andrew John Tomko | 2020-06-30 |
| 10615006 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2020-04-07 |
| 10580620 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2020-03-03 |
| 10546728 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2020-01-28 |
| 10537013 | Distributed electro-static chuck cooling | Fernando Silveira, Richard Fovell | 2020-01-14 |
| 10535502 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2020-01-14 |
| 10453656 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2019-10-22 |
| 10386126 | Apparatus for controlling temperature uniformity of a substrate | Kallol Bera, Xiaoping Zhou, Douglas A. Buchberger, Jr., Andrew Nguyen, Surajit Kumar +1 more | 2019-08-20 |
| 9799491 | Low electron temperature etch chamber with independent control over plasma density, radical composition and ion energy for atomic precision etching | Leonid Dorf, Kenneth S. Collins, Shahid Rauf, Kartik Ramaswamy, James D. Carducci +2 more | 2017-10-24 |
| 9741546 | Symmetric plasma process chamber | James D. Carducci, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr. +3 more | 2017-08-22 |
| 9564297 | Electron beam plasma source with remote radical source | Ming-Feng Wu, Leonid Dorf, Shahid Rauf, Ying Zhang, Kenneth S. Collins +2 more | 2017-02-07 |
| 9267742 | Apparatus for controlling the temperature uniformity of a substrate | Kallol Bera, Xiaoping Zhou, Douglas A. Buchberger, Jr., Andrew Nguyen, Surajit Kumar +1 more | 2016-02-23 |
| 9248509 | Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity | Surajit Kumar, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr. | 2016-02-02 |
| 9214315 | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow | Fernando Silveira, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr., Brad L. Mays +5 more | 2015-12-15 |
| 8980044 | Plasma reactor with a multiple zone thermal control feed forward control apparatus | Paul Brillhart, Richard Fovell, Douglas A. Buchberger, Jr., Douglas H. Burns, Kallol Bera +5 more | 2015-03-17 |
| 8916793 | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow | Fernando Silveira, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr., Brad L. Mays +5 more | 2014-12-23 |
| 8822876 | Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity | Surajit Kumar, Kallol Bera, Xiaoping Zhou, Shane C. Nevil, Douglas A. Buchberger, Jr. | 2014-09-02 |
| 8629370 | Assembly for delivering RF power and DC voltage to a plasma processing chamber | Surajit Kumar, Shane C. Nevil, Douglas A. Buchberger, Jr. | 2014-01-14 |
| 8617351 | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction | Daniel J. Hoffman, Roger Alan Lindley, Michael Kutney, Martin Jeff Salinas, Keiji Horioka +1 more | 2013-12-31 |
| 8608900 | Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Douglas H. Burns, Kallol Bera +1 more | 2013-12-17 |
| 8337660 | Capacitively coupled plasma reactor having very agile wafer temperature control | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Douglas H. Burns, Kallol Bera +5 more | 2012-12-25 |
| 8236105 | Apparatus for controlling gas flow in a semiconductor substrate processing chamber | Kallol Bera, Heeyeop Chae, Yan Ye | 2012-08-07 |
| 8221580 | Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Douglas H. Burns, Kallol Bera +5 more | 2012-07-17 |