Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-step anneal of thin films for film densification and improved gap-fill

Multi-step anneal of thin films for film densification and improved gap-fill

US Patent 7642171 · Granted Jan 5, 2010

Estimated economic value: $23,823,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Congestion control2025
Self-aligned wide backside power rail contacts to multiple transistor sources2025
Selective etching between silicon-and-germanium-containing materials with varyin2025
Streaming secondary device content on a web conference2025
Semiconductor chamber components with advanced dual layer nickel-containing coat2025
Selective etching of silicon-and-germanium-containing materials with increased s2025
Electric motor stator structure and pouring and sealing method therefor2025
Low temperature graphene growth2025
Multi color stack for self aligned dual pattern formation for multi purpose devi2025
Spatial chat2025
Receiver-based precision congestion control2025
Methods for removing etch stop layers2025