Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355391 | Method for forming a metal gapfill | Xi Cen, Kai Wu, Yu Lei, Kazuya Daito, Yi Xu +13 more | 2022-06-07 |
| 10861676 | Metal recess for semiconductor structures | Zhenjiang Cui, Nitin K. Ingle, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-08 |
| 10854426 | Metal recess for semiconductor structures | Zhenjiang Cui, Nitin K. Ingle, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-01 |
| 10727119 | Process integration approach of selective tungsten via fill | He Ren, Yu Lei, Kai Wu, Mehul Naik, Zhiyuan Wu +2 more | 2020-07-28 |
| 10395916 | In-situ pre-clean for selectivity improvement for selective deposition | Kai Wu, Vikash Banthia, Sang Ho Yu, Mei Chang | 2019-08-27 |
| 10256144 | Process integration approach of selective tungsten via fill | He Ren, Yu Lei, Kai Wu, Mehul Naik, Zhiyuan Wu +2 more | 2019-04-09 |
| 9947578 | Methods for forming low-resistance contacts through integrated process flow systems | Yu Lei, Vikash Banthia, Kai Wu, Xinyu Fu, Yi Xu +9 more | 2018-04-17 |