Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300503 | Etching of metal oxides using fluorine and metal halides | Keenan N. Woods, Mark Saly | 2025-05-13 |
| 12300501 | Systems and methods for selective metal compound removal | Anchuan Wang | 2025-05-13 |
| 12272563 | Metal oxide directional removal | Baiwei Wang, Rohan Puligoru Reddy, Xiaolin Chen, Anchuan Wang | 2025-04-08 |
| 12087595 | Metal deposition and etch in high aspect-ratio features | Baiwei Wang, Rohan Puligoru Reddy, Xiaolin Chen, Anchuan Wang | 2024-09-10 |
| 11984325 | Selective removal of transition metal nitride materials | Baiwei Wang, Xiaolin Chen, Rohan Puligoru Reddy, Oliver Jan, Anchuan Wang | 2024-05-14 |
| 11798813 | Selective removal of ruthenium-containing materials | Baiwei Wang, Xiaolin Chen, Rohan Puligoru Reddy, Oliver Jan, Anchuan Wang | 2023-10-24 |
| 11769671 | Systems and methods for selective metal compound removal | Anchuan Wang | 2023-09-26 |
| 11728177 | Systems and methods for nitride-containing film removal | Baiwei Wang, Oliver Jan, Rohan Puligoru Reddy, Xiaolin Chen, Anchuan Wang | 2023-08-15 |
| 11682560 | Systems and methods for hafnium-containing film removal | Hanshen Zhang, Daniella Holm | 2023-06-20 |
| 11631589 | Metal etch in high aspect-ratio features | Baiwei Wang, Xiaolin Chen, Rohan Puligoru Reddy, Oliver Jan, Anchuan Wang | 2023-04-18 |
| 11488835 | Systems and methods for tungsten-containing film removal | Rohan Puligoru Reddy, Anchuan Wang | 2022-11-01 |
| 11328909 | Chamber conditioning and removal processes | Hanshen Zhang, Nitin K. Ingle | 2022-05-10 |
| 11121002 | Systems and methods for etching metals and metal derivatives | Hanshen Zhang, Siliang Chang, Daniella Holm | 2021-09-14 |
| 11062921 | Systems and methods for aluminum-containing film removal | Anchuan Wang, Rohan Puligoru Reddy, Xiaolin Chen | 2021-07-13 |
| 10861676 | Metal recess for semiconductor structures | Nitin K. Ingle, Feiyue Ma, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-08 |
| 10854426 | Metal recess for semiconductor structures | Nitin K. Ingle, Feiyue Ma, Hanshen Zhang, Siliang Chang, Daniella Holm | 2020-12-01 |
| 9960049 | Two-step fluorine radical etch of hafnium oxide | Hanshen Zhang, Jie Liu | 2018-05-01 |
| 9947549 | Cobalt-containing material removal | Xikun Wang, Soonam Park, Nitin K. Ingle | 2018-04-17 |
| 9576788 | Cleaning high aspect ratio vias | Jie Liu, Seung Ho Park, Anchuan Wang, Nitin K. Ingle | 2017-02-21 |
| 9478434 | Chlorine-based hardmask removal | Xikun Wang, Mandar B. Pandit, Mikhail Korolik, Anchuan Wang, Nitin K. Ingle +1 more | 2016-10-25 |
| 9355862 | Fluorine-based hardmask removal | Mandar B. Pandit, Xikun Wang, Mikhail Korolik, Anchuan Wang, Nitin K. Ingle | 2016-05-31 |
| 8951911 | Process for damascene structure with reduced low-k damage | Mehul Naik | 2015-02-10 |
| 8058183 | Restoring low dielectric constant film properties | May Yu, Alexandros T. Demos, Mehul Naik | 2011-11-15 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Kang Sub Yim, Mehul Naik, Mihaela Balseanu +2 more | 2011-02-01 |
| 7811924 | Air gap formation and integration using a patterning cap | Mehul Naik, Christopher Dennis Bencher, Kenneth P. MacWilliams | 2010-10-12 |