| 11682560 |
Systems and methods for hafnium-containing film removal |
Zhenjiang Cui, Daniella Holm |
2023-06-20 |
| 11637002 |
Methods and systems to enhance process uniformity |
Saravjeet Singh, Alan Tso, Jingchun Zhang, Zihui Li, Dmitry Lubomirsky |
2023-04-25 |
| 11328909 |
Chamber conditioning and removal processes |
Zhenjiang Cui, Nitin K. Ingle |
2022-05-10 |
| 11239061 |
Methods and systems to enhance process uniformity |
Saravjeet Singh, Alan Tso, Jingchun Zhang, Zihui Li, Dmitry Lubomirsky |
2022-02-01 |
| 11121002 |
Systems and methods for etching metals and metal derivatives |
Zhenjiang Cui, Siliang Chang, Daniella Holm |
2021-09-14 |
| 10861676 |
Metal recess for semiconductor structures |
Zhenjiang Cui, Nitin K. Ingle, Feiyue Ma, Siliang Chang, Daniella Holm |
2020-12-08 |
| 10854426 |
Metal recess for semiconductor structures |
Zhenjiang Cui, Nitin K. Ingle, Feiyue Ma, Siliang Chang, Daniella Holm |
2020-12-01 |
| 10692880 |
3D NAND high aspect ratio structure etch |
Zhenjiang Cui, Anchuan Wang, Zhijun Chen, Nitin K. Ingle |
2020-06-23 |
| 9960049 |
Two-step fluorine radical etch of hafnium oxide |
Jie Liu, Zhenjiang Cui |
2018-05-01 |
| 9881805 |
Silicon selective removal |
Zihui Li, Ching-Mei Hsu, Jingchun Zhang |
2018-01-30 |
| 9564338 |
Silicon-selective removal |
Jingchun Zhang |
2017-02-07 |
| 9472412 |
Procedure for etch rate consistency |
Jingchun Zhang |
2016-10-18 |
| 9245762 |
Procedure for etch rate consistency |
Jingchun Zhang |
2016-01-26 |
