Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776806 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2023-10-03 |
| 11380536 | Multi-step pre-clean for selective metal gap fill | Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more | 2022-07-05 |
| 11355391 | Method for forming a metal gapfill | Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more | 2022-06-07 |
| D942516 | Process shield for a substrate processing chamber | Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni | 2022-02-01 |
| D933725 | Deposition ring for a substrate processing chamber | Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni | 2021-10-19 |
| D891382 | Process shield for a substrate processing chamber | Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni | 2020-07-28 |
| 9653318 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Joshua Collins, Mei Chang | 2017-05-16 |
| 9552968 | Plasma cleaning apparatus and method | Martin Deehan, Matt Cheng-Hsiung Tsai, Nan Lu, Mei Chang | 2017-01-24 |
| 9245769 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Joshua Collins, Mei Chang | 2016-01-26 |
| 9202745 | Directional SiO2 etch using low-temperature etchant deposition and plasma post-treatment | Joshua Collins, Mei Chang | 2015-12-01 |
| 9177780 | Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition | Joshua Collins, Mei Chang | 2015-11-03 |
| 9004006 | Process chamber lid design with built-in plasma source for short lifetime species | Chien-Teh Kao, Hyman Lam, Mei Chang, Nicholas R. Denny, Xiaoxiong Yuan | 2015-04-14 |
| 8980761 | Directional SIO2 etch using low-temperature etchant deposition and plasma post-treatment | Joshua Collins, Mei Chang | 2015-03-17 |
| 8748322 | Silicon oxide recess etch | Nancy Fung, Qingjun Zhou, Lina Zhu, Jeremiah T. Pender, Srinivas D. Nemani +3 more | 2014-06-10 |
| 8721796 | Plasma cleaning apparatus and method | Martin Deehan, Matt Cheng-Hsiung Tsai, Nan Lu, Mei Chang | 2014-05-13 |
| 8252696 | Selective etching of silicon nitride | Xinliang Lu, Haichun Yang, Zhenbin Ge, Nan Lu, Chien-Teh Kao +1 more | 2012-08-28 |
| 7910853 | Direct real-time monitoring and feedback control of RF plasma output for wafer processing | Yu-Tzu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang | 2011-03-22 |
| 7871470 | Substrate support lift mechanism | Eric W. Schieve, Keith Kuang-Kuo Koai, Rene T. Correa | 2011-01-18 |
| D568914 | Substrate support lift pin | Keith Kuang-Kuo Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato | 2008-05-13 |
| 6887317 | Reduced friction lift pin | Keith Kuang-Kuo Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato | 2005-05-03 |
| 6364949 | 300 mm CVD chamber design for metal-organic thin film deposition | Keith Kuang-Kuo Koai, Fufa Chen, Lawrence Chung-Lai Lei | 2002-04-02 |
| 5953827 | Magnetron with cooling system for process chamber of processing system | David Datong Huo, J. Darrel Stickler | 1999-09-21 |
| D403337 | High conductance low wall deposition upper shield | — | 1998-12-29 |