| 11776806 |
Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more |
2023-10-03 |
$34,462,000 |
| 11380536 |
Multi-step pre-clean for selective metal gap fill |
Xi Cen, Yakuan Yao, Yiming Lai, Kai Wu, Avgerinos V. Gelatos +8 more |
2022-07-05 |
$35,888,000 |
| 11355391 |
Method for forming a metal gapfill |
Xi Cen, Feiyue Ma, Kai Wu, Yu Lei, Kazuya Daito +13 more |
2022-06-07 |
$46,649,000 |
| D942516 |
Process shield for a substrate processing chamber |
Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni |
2022-02-01 |
|
| D933725 |
Deposition ring for a substrate processing chamber |
Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni |
2021-10-19 |
|
| D891382 |
Process shield for a substrate processing chamber |
Manjunatha Koppa, Aravind Kamath, Cheng-Hsiung Tsai, Manjunath H. Venkataswamappa, Steven V. Sansoni |
2020-07-28 |
|
| 9653318 |
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition |
Joshua Collins, Mei Chang |
2017-05-16 |
$17,932,000 |
| 9552968 |
Plasma cleaning apparatus and method |
Martin Deehan, Matt Cheng-Hsiung Tsai, Nan Lu, Mei Chang |
2017-01-24 |
$20,961,000 |
| 9245769 |
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition |
Joshua Collins, Mei Chang |
2016-01-26 |
$7,094,000 |
| 9202745 |
Directional SiO2 etch using low-temperature etchant deposition and plasma post-treatment |
Joshua Collins, Mei Chang |
2015-12-01 |
$8,913,000 |
| 9177780 |
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition |
Joshua Collins, Mei Chang |
2015-11-03 |
$6,969,000 |
| 9004006 |
Process chamber lid design with built-in plasma source for short lifetime species |
Chien-Teh Kao, Hyman Lam, Mei Chang, Nicholas R. Denny, Xiaoxiong Yuan |
2015-04-14 |
$19,339,000 |
| 8980761 |
Directional SIO2 etch using low-temperature etchant deposition and plasma post-treatment |
Joshua Collins, Mei Chang |
2015-03-17 |
$8,353,000 |
| 8748322 |
Silicon oxide recess etch |
Nancy Fung, Qingjun Zhou, Lina Zhu, Jeremiah T. Pender, Srinivas D. Nemani +3 more |
2014-06-10 |
$12,688,000 |
| 8721796 |
Plasma cleaning apparatus and method |
Martin Deehan, Matt Cheng-Hsiung Tsai, Nan Lu, Mei Chang |
2014-05-13 |
$10,757,000 |
| 8252696 |
Selective etching of silicon nitride |
Xinliang Lu, Haichun Yang, Zhenbin Ge, Nan Lu, Chien-Teh Kao +1 more |
2012-08-28 |
$5,542,000 |
| 7910853 |
Direct real-time monitoring and feedback control of RF plasma output for wafer processing |
Yu-Tzu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang |
2011-03-22 |
$5,133,000 |
| 7871470 |
Substrate support lift mechanism |
Eric W. Schieve, Keith Kuang-Kuo Koai, Rene T. Correa |
2011-01-18 |
$15,285,000 |
| D568914 |
Substrate support lift pin |
Keith Kuang-Kuo Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato |
2008-05-13 |
|
| 6887317 |
Reduced friction lift pin |
Keith Kuang-Kuo Koai, Hiroyuki Takahama, Takahiro Ito, Koji Ota, Hiroshi Sato |
2005-05-03 |
$16,365,000 |
| 6364949 |
300 mm CVD chamber design for metal-organic thin film deposition |
Keith Kuang-Kuo Koai, Fufa Chen, Lawrence Chung-Lai Lei |
2002-04-02 |
$41,044,000 |
| 5953827 |
Magnetron with cooling system for process chamber of processing system |
David Datong Huo, J. Darrel Stickler |
1999-09-21 |
$147,199,000 |
| D403337 |
High conductance low wall deposition upper shield |
— |
1998-12-29 |
|
