Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394670 | Nucleation-free gap fill ALD process | Yihong Chen, Kelvin Chan, Srinivas Gandikota, Yong Wu, Susmit Singha Roy +1 more | 2025-08-19 |
| 11791181 | Methods for the treatment of workpieces | Ting Xie, Hua Chung, Haochen Li, Shawming Ma, Haichun Yang +1 more | 2023-10-17 |
| 11626269 | Chamber seasoning to improve etch uniformity by reducing chemistry | Qi Zhang, Hua Chung | 2023-04-11 |
| 11495437 | Surface pretreatment process to improve quality of oxide films produced by remote plasma | Ting Xie, Hua Chung, Michael X. Yang | 2022-11-08 |
| 11495456 | Ozone for selective hydrophilic surface treatment | Ting Xie, Hua Chung, Michael X. Yang | 2022-11-08 |
| 11387111 | Processing of workpieces with reactive species generated using alkyl halide | Michael X. Yang, Hua Chung | 2022-07-12 |
| 11289374 | Nucleation-free gap fill ALD process | Yihong Chen, Kelvin Chan, Srinivas Gandikota, Yong Wu, Susmit Singha Roy +1 more | 2022-03-29 |
| 11257680 | Methods for processing a workpiece using fluorine radicals | Qi Zhang | 2022-02-22 |
| 11251050 | Silicon oxide selective dry etch process | Qi Zhang, Hua Chung, Haichun Yang | 2022-02-15 |
| 11164727 | Processing of workpieces using hydrogen radicals and ozone gas | Ting Xie, Hua Chung, Bin Dong, Haichun Yang, Michael X. Yang | 2021-11-02 |
| 11164742 | Selective deposition using methylation treatment | Michael X. Yang, Hua Chung | 2021-11-02 |
| 11164725 | Generation of hydrogen reactive species for processing of workpieces | Qi Zhang, Hua Chung, Michael X. Yang | 2021-11-02 |
| 11107695 | Surface smoothing of workpieces | Qi Zhang, Hua Chung | 2021-08-31 |
| 11062910 | Surface treatment of silicon or silicon germanium surfaces using organic radicals | Michael X. Yang, Hua Chung | 2021-07-13 |
| 11043393 | Ozone treatment for selective silicon nitride etch over silicon | Shanyu Wang, Ting Xie, Chun Yan, Hua Chung, Michael X. Yang | 2021-06-22 |
| 11039527 | Air leak detection in plasma processing apparatus with separation grid | Shuang Meng, Shawming Ma, Hua Chung | 2021-06-15 |
| 10964528 | Integration of materials removal and surface treatment in semiconductor device fabrication | Michael X. Yang, Hua Chung, Haochen Li, Ting Xie, Qi Zhang | 2021-03-30 |
| 10950428 | Method for processing a workpiece | Ting Xie, Hua Chung, Shawming Ma, Michael X. Yang | 2021-03-16 |
| 10950416 | Chamber seasoning to improve etch uniformity by reducing chemistry | Qi Zhang, Hua Chung | 2021-03-16 |
| 10910228 | Surface treatment of carbon containing films using organic radicals | Michael X. Yang, Hua Chung | 2021-02-02 |
| 10854511 | Methods of lowering wordline resistance | Yihong Chen, Yong Wu, Chia Cheng Chin, Srinivas Gandikota, Ziqing Duan +1 more | 2020-12-01 |
| 10804109 | Surface treatment of silicon and carbon containing films by remote plasma with organic precursors | Michael X. Yang, Hua Chung | 2020-10-13 |
| 10692730 | Silicon oxide selective dry etch process | Qi Zhang, Hua Chung, Haichun Yang | 2020-06-23 |
| 10403492 | Integration of materials removal and surface treatment in semiconductor device fabrication | Michael X. Yang, Hua Chung, Haochen Li, Ting Xie, Qi Zhang | 2019-09-03 |
| 10354883 | Surface treatment of silicon or silicon germanium surfaces using organic radicals | Michael X. Yang, Hua Chung | 2019-07-16 |