Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11649559 | Method of utilizing a degassing chamber to reduce arsenic outgassing following deposition of arsenic-containing material on a substrate | Xinyu BAO, Hua Chung, Schubert S. Chu | 2023-05-16 |
| 11651977 | Processing of workpieces using fluorocarbon plasma | Shanyu Wang | 2023-05-16 |
| 11462413 | Processing of workpieces using deposition process and etch process | Shanyu Wang, Hua Chung, Michael X. Yang, Tsai Wen Sung, Qi Zhang | 2022-10-04 |
| 11387115 | Silicon mandrel etch after native oxide punch-through | Tsai Wen Sung, Sio On Lo, Hua Chung, Michael X. Yang | 2022-07-12 |
| 11276560 | Spacer etching process | Tsai Wen Sung, Michael X. Yang | 2022-03-15 |
| 11195718 | Spacer open process by dual plasma | Tsai Wen Sung, Hua Chung, Michael X. Yang, Dixit V. Desai, Peter J. Lembesis | 2021-12-07 |
| 11043393 | Ozone treatment for selective silicon nitride etch over silicon | Shanyu Wang, Ting Xie, Xinliang Lu, Hua Chung, Michael X. Yang | 2021-06-22 |
| 10224421 | Self-aligned process for sub-10nm fin formation | Zhiyuan Ye, Xinyu BAO, Hua Chung, Schubert S. Chu, Satheesh Kuppurao | 2019-03-05 |
| 10177017 | Method for conditioning a processing chamber for steady etching rate control | — | 2019-01-08 |
| 10090147 | Integrated system and method for source/drain engineering | Xinyu BAO, Melitta Hon, Hua Chung, Schubert S. Chu | 2018-10-02 |
| 9484220 | Sputter etch processing for heavy metal patterning in integrated circuits | Mark Hoinkis, Eric A. Joseph, Hiroyuki Miyazoe | 2016-11-01 |
| 9114438 | Copper residue chamber clean | Mark Hoinkis, Hiroyuki Miyazoe, Eric A. Joseph | 2015-08-25 |
| 8871107 | Subtractive plasma etching of a blanket layer of metal or metal alloy | Nicholas C. M. Fuller, Eric A. Joseph, Hiroyuki Miyazoe, Mark Hoinkis | 2014-10-28 |
| 7442114 | Methods for silicon electrode assembly etch rate and etch uniformity recovery | Tuochuan Huang, Daxing Ren, Hong Shih, Catherine Zhou, Enrico Magni +4 more | 2008-10-28 |
| 7374636 | Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor | Keiji Horioka, Taeho Shin, Roger Alan Lindley, Panyin Hughes, Douglas H. Burns +4 more | 2008-05-20 |
| 7320942 | Method for removal of metallic residue after plasma etching of a metal layer | Xiaoyi Chen, Chentsau Ying, Padmapani Nallan, Ajay Kumar, Ralph Kerns +3 more | 2008-01-22 |
| 7316199 | Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber | Keiji Horioka, Taeho Shin, Roger Alan Lindley, Qi Li, Panyin Hughes +3 more | 2008-01-08 |
| 6933239 | Method for removing conductive residue | Chentsau Ying, Xiaoyi Chen, Ajay Kumar | 2005-08-23 |
| 6649532 | Methods for etching an organic anti-reflective coating | Hui Chen, Xikun Wang, Hong Shih, Wai-Fan Yau | 2003-11-18 |
| 6620289 | Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system | Yan Ye, Diana Xiaobing Ma | 2003-09-16 |
| 6547977 | Method for etching low k dielectrics | Gary Hsueh, Yan Ye, Diana Xiaobing Ma | 2003-04-15 |
| 6537918 | Method for etching silicon oxynitride and dielectric antireflection coatings | Pavel Ionov, Sung Ho Kim, Dean Li, James C. Wang | 2003-03-25 |
| 6458516 | Method of etching dielectric layers using a removable hardmask | Yan Ye, Pavel Ionov, Allen Zhao, Peter Hsieh, Diana Xiaobing Ma +1 more | 2002-10-01 |
| 6352049 | Plasma assisted processing chamber with separate control of species density | Gerald Yin, Arnold Kolandenko, Hong Ching Shan, Peter Loewenhardt, Chii Guang Lee +9 more | 2002-03-05 |
| 6331380 | Method of pattern etching a low K dielectric layer | Yan Ye, Pavel Ionov, Allen Zhao, Peter Hsieh, Diana Xiaobing Ma +1 more | 2001-12-18 |