Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960052 | Methods for etching a metal layer to form an interconnection structure for semiconductor applications | Sumit Agarwal, Ann Chien, Chiu-pien KUO, Bradley J. Howard | 2018-05-01 |
| 9493879 | Selective sputtering for pattern transfer | Hiroyuki Miyazoe, Eric A. Joseph | 2016-11-15 |
| 9484220 | Sputter etch processing for heavy metal patterning in integrated circuits | Eric A. Joseph, Hiroyuki Miyazoe, Chun Yan | 2016-11-01 |
| 9171796 | Sidewall image transfer for heavy metal patterning in integrated circuits | Markus Brink, Michael A. Guillorn, Eric A. Joseph, Hiroyuki Miyazoe, Bang N. To | 2015-10-27 |
| 9114438 | Copper residue chamber clean | Chun Yan, Hiroyuki Miyazoe, Eric A. Joseph | 2015-08-25 |
| 8871107 | Subtractive plasma etching of a blanket layer of metal or metal alloy | Nicholas C. M. Fuller, Eric A. Joseph, Hiroyuki Miyazoe, Chun Yan | 2014-10-28 |
| 7786007 | Method and apparatus of stress relief in semiconductor structures | Matthias Hierlemann, Gerald Friese, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu | 2010-08-31 |
| 7494915 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Erdem Kaltalioglu +8 more | 2009-02-24 |
| 7368804 | Method and apparatus of stress relief in semiconductor structures | Matthias Hierlemann, Gerald Friese, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu | 2008-05-06 |
| 7241681 | Bilayered metal hardmasks for use in dual damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2007-07-10 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer | Larry Clevenger, Timothy J. Dalton, Steffen K. Kaldor, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more | 2007-07-10 |
| 7122462 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Erdem Kaltalioglu +8 more | 2006-10-17 |
| 7091612 | Dual damascene structure and method | Kaushik A. Kumar, Timothy J. Dalton, Larry Clevenger, Andy Cowley, Douglas C. La Tulipe, Jr. +5 more | 2006-08-15 |
| 7060619 | Reduction of the shear stress in copper via's in organic interlayer dielectric material | Andy Cowley, Erdem Kaltalioglu, Michael Stetter | 2006-06-13 |
| 7052621 | Bilayered metal hardmasks for use in Dual Damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2006-05-30 |
| 7001835 | Crystallographic modification of hard mask properties | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Kaushik A. Kumar +3 more | 2006-02-21 |
| 6960835 | Stress-relief layer for semiconductor applications | Hans-Joachim Barth, Erdem Kaltalioglu, Gerald Friese, Pak K. Leung | 2005-11-01 |
| 6870263 | Device interconnection | Lawrence A. Clevenger, Ronald G. Filippi, Jeffery L. Hurd, Roy Iggulden, Herbert Palm +5 more | 2005-03-22 |
| 6864171 | Via density rules | Matthias Hierlemann, Mohammed Fazil Fayaz, Andy Cowley, Erdum Kaltalioglu | 2005-03-08 |
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, John A. Miller, Soon-Cheon Seo, Yun-Yu Wang, Kwong Hon Wong | 2003-04-01 |
| 6383929 | Copper vias in low-k technology | Steven H. Boettcher, Herbert L. Ho, Hyun Koo Lee, Yun-Yu Wang, Kwong Hon Wong | 2002-05-07 |
| 6242789 | Vertical fuse and method of fabrication | Stefan Weber, Axel Brintzinger, Roy Iggulden, Chandrasekhar Narayan, Robert Willem Van Den Berg | 2001-06-05 |
| 6221757 | Method of making a microelectronic structure | Sven Schmidbauer, Alexander Ruf, Florian Schnabel, Stefan Weber | 2001-04-24 |
| 6218279 | Vertical fuse and method of fabrication | Stefan Weber, Axel Brintzinger, Roy Iggulden, Chandrasekhar Narayan, Robert Willem Van Den Berg | 2001-04-17 |
| 6218298 | Tungsten-filled deep trenches | — | 2001-04-17 |