| 9960052 |
Methods for etching a metal layer to form an interconnection structure for semiconductor applications |
Sumit Agarwal, Ann Chien, Chiu-pien KUO, Bradley J. Howard |
2018-05-01 |
$18,276,000 |
| 9493879 |
Selective sputtering for pattern transfer |
Hiroyuki Miyazoe, Eric A. Joseph |
2016-11-15 |
$32,851,000 |
| 9484220 |
Sputter etch processing for heavy metal patterning in integrated circuits |
Eric A. Joseph, Hiroyuki Miyazoe, Chun Yan |
2016-11-01 |
$3,150,000 |
| 9171796 |
Sidewall image transfer for heavy metal patterning in integrated circuits |
Markus Brink, Michael A. Guillorn, Eric A. Joseph, Hiroyuki Miyazoe, Bang N. To |
2015-10-27 |
$4,228,000 |
| 9114438 |
Copper residue chamber clean |
Chun Yan, Hiroyuki Miyazoe, Eric A. Joseph |
2015-08-25 |
$10,519,000 |
| 8871107 |
Subtractive plasma etching of a blanket layer of metal or metal alloy |
Nicholas C. M. Fuller, Eric A. Joseph, Hiroyuki Miyazoe, Chun Yan |
2014-10-28 |
$3,762,000 |
| 7786007 |
Method and apparatus of stress relief in semiconductor structures |
Matthias Hierlemann, Gerald Friese, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu |
2010-08-31 |
|
| 7494915 |
Back end interconnect with a shaped interface |
Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Erdem Kaltalioglu +8 more |
2009-02-24 |
|
| 7368804 |
Method and apparatus of stress relief in semiconductor structures |
Matthias Hierlemann, Gerald Friese, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu |
2008-05-06 |
$508,000 |
| 7241681 |
Bilayered metal hardmasks for use in dual damascene etch schemes |
Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more |
2007-07-10 |
|
| 7241696 |
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer |
Larry Clevenger, Timothy J. Dalton, Steffen K. Kaldor, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more |
2007-07-10 |
|
| 7122462 |
Back end interconnect with a shaped interface |
Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Erdem Kaltalioglu +8 more |
2006-10-17 |
|
| 7091612 |
Dual damascene structure and method |
Kaushik A. Kumar, Timothy J. Dalton, Larry Clevenger, Andy Cowley, Douglas C. La Tulipe, Jr. +5 more |
2006-08-15 |
|
| 7060619 |
Reduction of the shear stress in copper via's in organic interlayer dielectric material |
Andy Cowley, Erdem Kaltalioglu, Michael Stetter |
2006-06-13 |
$121,000 |
| 7052621 |
Bilayered metal hardmasks for use in Dual Damascene etch schemes |
Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more |
2006-05-30 |
|
| 7001835 |
Crystallographic modification of hard mask properties |
Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Steffen K. Kaldor, Kaushik A. Kumar +3 more |
2006-02-21 |
|
| 6960835 |
Stress-relief layer for semiconductor applications |
Hans-Joachim Barth, Erdem Kaltalioglu, Gerald Friese, Pak K. Leung |
2005-11-01 |
|
| 6870263 |
Device interconnection |
Lawrence A. Clevenger, Ronald G. Filippi, Jeffery L. Hurd, Roy Iggulden, Herbert Palm +5 more |
2005-03-22 |
$80,000 |
| 6864171 |
Via density rules |
Matthias Hierlemann, Mohammed Fazil Fayaz, Andy Cowley, Erdum Kaltalioglu |
2005-03-08 |
$71,000 |
| 6539625 |
Chromium adhesion layer for copper vias in low-k technology |
Brett H. Engel, John A. Miller, Soon-Cheon Seo, Yun-Yu Wang, Kwong Hon Wong |
2003-04-01 |
|
| 6383929 |
Copper vias in low-k technology |
Steven H. Boettcher, Herbert L. Ho, Hyun Koo Lee, Yun-Yu Wang, Kwong Hon Wong |
2002-05-07 |
|
| 6242789 |
Vertical fuse and method of fabrication |
Stefan Weber, Axel Brintzinger, Roy Iggulden, Chandrasekhar Narayan, Robert Willem Van Den Berg |
2001-06-05 |
|
| 6221757 |
Method of making a microelectronic structure |
Sven Schmidbauer, Alexander Ruf, Florian Schnabel, Stefan Weber |
2001-04-24 |
$5,077,000 |
| 6218279 |
Vertical fuse and method of fabrication |
Stefan Weber, Axel Brintzinger, Roy Iggulden, Chandrasekhar Narayan, Robert Willem Van Den Berg |
2001-04-17 |
|
| 6218298 |
Tungsten-filled deep trenches |
— |
2001-04-17 |
$1,450,000 |
