Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7843035 | MIM capacitors with catalytic activation layer | Hans-Joachim Barth, Petra Felsner, Erdem Kaltalioglu | 2010-11-30 |
| 7786007 | Method and apparatus of stress relief in semiconductor structures | Mark Hoinkis, Matthias Hierlemann, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu | 2010-08-31 |
| 7436016 | MIM capacitor with a cap layer over the conductive plates | Hans-Joachim Barth, Petra Felsner, Erdem Kaltalioglu | 2008-10-14 |
| 7368804 | Method and apparatus of stress relief in semiconductor structures | Mark Hoinkis, Matthias Hierlemann, Andy Cowley, Dennis J. Warner, Erdem Kaltalioglu | 2008-05-06 |
| 6960835 | Stress-relief layer for semiconductor applications | Hans-Joachim Barth, Erdem Kaltalioglu, Mark Hoinkis, Pak K. Leung | 2005-11-01 |
| 6949442 | Methods of forming MIM capacitors | Hans-Joachim Barth, Petra Felsner, Erdem Kaltalioglu | 2005-09-27 |
| 6872648 | Reduced splattering of unpassivated laser fuses | Andy Cowley, Mohammed Fazil Fayaz, William T. Motsiff | 2005-03-29 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Werner Robl, Hans-Joachim Barth, Axel Brintzinger | 2005-03-15 |
| 6750113 | Metal-insulator-metal capacitor in copper | Michael D. Armacost, Andreas Augustin, John E. Heidenreich, III, Gary Robert Hueckel, Kenneth J. Stein | 2004-06-15 |
| 6730982 | FBEOL process for Cu metallizations free from Al-wirebond pads | Hans-Joachim Barth, Petra Felsner, Erdem Kaltalioglu | 2004-05-04 |
| 6720212 | Method of eliminating back-end rerouting in ball grid array packaging | Werner Robl, Thomas Goebel, Axel Brintzinger | 2004-04-13 |
| 6559042 | Process for forming fusible links | Hans-Joachim Barth, Lloyd Burrell, Michael Stetter | 2003-05-06 |
| 6451664 | Method of making a MIM capacitor with self-passivating plates | Hans-Joachim Barth, Petra Felsner | 2002-09-17 |