Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12314340 | Anomaly detection from aggregate statistics using neural networks | Jimmy Iskandar | 2025-05-27 |
| 11657122 | Anomaly detection from aggregate statistics using neural networks | Jimmy Iskandar | 2023-05-23 |
| 11378426 | System and method for monitoring sensor linearity as part of a production process | Bradley D. Schulze | 2022-07-05 |
| 10901407 | Semiconductor device search and classification | Jimmy Iskandar, Heng HAO | 2021-01-26 |
| 10770321 | Process kit erosion and service life prediction | Kang-Lie Chiang, Greg Blackburn, Pallavi Zhang, Nitin Khurana | 2020-09-08 |
| 10541169 | Method and system for balancing the electrostatic chucking force on a substrate | Chong Jiang, Lei Jing, Mingte Liu, Adolph Miller Allen, Michael W. Johnson +1 more | 2020-01-21 |
| 10303812 | Topography prediction using system state information | Jimmy Iskandar, Chong Jiang, Bradley D. Schulze | 2019-05-28 |
| 10177018 | Process kit erosion and service life prediction | Kang-Lie Chiang, Greg Blackburn, Pallavi Zhang, Nitin Khurana | 2019-01-08 |
| 8143138 | Method for fabricating interconnect structures for semiconductor devices | Ryan Patz, Igor Peidous, Jeremiah T. Pender | 2012-03-27 |
| 7758763 | Plasma for resist removal and facet control of underlying features | Yifeng Zhou, Siyi Li, Terry Leung | 2010-07-20 |
| 7572734 | Etch depth control for dual damascene fabrication process | Mehul Naik, Suketu Arun Parikh | 2009-08-11 |
| 7226853 | Method of forming a dual damascene structure utilizing a three layer hard mask structure | Nikolaos Bekiaris, Timothy Weidman, Mehul Naik | 2007-06-05 |
| 7115534 | Dielectric materials to prevent photoresist poisoning | Son V. Nguyen, Mehul Naik, Girish Dixit, Ellie Yieh | 2006-10-03 |
| 6829056 | Monitoring dimensions of features at different locations in the processing of substrates | Michael Barnes, John D. Holland, II, Hongqing Shan, Bryan Pu, Mohit Jain +5 more | 2004-12-07 |
| 6780753 | Airgap for semiconductor devices | Ian Latchford, Christopher Dennis Bencher, Timothy Weidman, Christopher S. Ngai | 2004-08-24 |
| 6750113 | Metal-insulator-metal capacitor in copper | Andreas Augustin, Gerald Friese, John E. Heidenreich, III, Gary Robert Hueckel, Kenneth J. Stein | 2004-06-15 |
| 6734096 | Fine-pitch device lithography using a sacrificial hardmask | Timothy J. Dalton, Minakshisundaran Balasubramanian Anand, Shyng-Tsong Chen, Stephen M. Gates, Stephen E. Greco +2 more | 2004-05-11 |
| 6656375 | Selective nitride: oxide anisotropic etch process | David M. Dobuzinsky, John C. Malinowski, Hung Y. Ng, Richard S. Wise, Chienfan Yu | 2003-12-02 |
| 6518112 | High performance, low power vertical integrated CMOS devices | Claude L. Bertin, Erik L. Hedberg, Jack A. Mandelman | 2003-02-11 |
| 6489005 | Method of making silicon article having columns | Peter D. Hoh, Son V. Nguyen | 2002-12-03 |
| 6342722 | Integrated circuit having air gaps between dielectric and conducting lines | Peter D. Hoh, David V. Horak, Richard S. Wise | 2002-01-29 |
| 6297531 | High performance, low power vertical integrated CMOS devices | Claude L. Bertin, Erik L. Hedberg, Jack A. Mandelman | 2001-10-02 |
| 6232222 | Method of eliminating a critical mask using a blockout mask and a resulting semiconductor structure | Richard A. Conti, Jeffrey P. Gambino, Jeremy K. Stephens | 2001-05-15 |
| 6228279 | High-density plasma, organic anti-reflective coating etch system compatible with sensitive photoresist materials | Peter D. Hoh, Richard S. Wise, Wendy Yan | 2001-05-08 |
| 6207353 | Resist formulation which minimizes blistering during etching | Willard E. Conley, Tina J. Cotler-Wagner, Ronald A. DellaGuardia, David M. Dobuzinsky, Michael L. Passow +1 more | 2001-03-27 |