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Copper to aluminum interlayer interconnect using stud and via liner |
Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, Hyun Koo Lee, Mark D. Levy +6 more |
2006-08-08 |
| 7037824 |
Copper to aluminum interlayer interconnect using stud and via liner |
Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, Hyun Koo Lee, Mark D. Levy +6 more |
2006-05-02 |
| 6750113 |
Metal-insulator-metal capacitor in copper |
Michael D. Armacost, Andreas Augustin, Gerald Friese, Gary Robert Hueckel, Kenneth J. Stein |
2004-06-15 |
| 6339024 |
Reinforced integrated circuits |
Kevin S. Petrarca, Judith M. Rubino, Carlos J. Sambucetti, Richard P. Volant, George F. Walker |
2002-01-15 |
| 6333559 |
Method/structure for creating aluminum wirebound pad on copper BEOL |
Gregory Costrini, Ronald D. Goldblatt, Thomas L. McDevitt |
2001-12-25 |
| 6187680 |
Method/structure for creating aluminum wirebound pad on copper BEOL |
Gregory Costrini, Ronald D. Goldblatt, Thomas L. McDevitt |
2001-02-13 |
| 5650032 |
Apparatus for producing an inductive plasma for plasma processes |
John H. Keller, Michael Barnes, John C. Forster |
1997-07-22 |
| 5340451 |
Process for producing a metal organic polymer combination |
Leena Paivikki Buchwalter, Stephen L. Buchwalter, Charles R. Davis, Ronald D. Goldblatt, Sharon L. Nunes +4 more |
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| 5298720 |
Method and apparatus for contamination control in processing apparatus containing voltage driven electrode |
Jerome J. Cuomo, Michael V. Grazioso, Charles R. Guarnieri, Kurt L. Haller, Gary S. Selwyn +1 more |
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| 5019210 |
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
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1991-05-28 |
