Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087997 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more | 2006-08-08 |
| 7037824 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more | 2006-05-02 |