Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334461 | Bonding structure using two oxide layers with different stress levels, and related method | Jorge A. Lubguban, Sarah H. Knickerbocker, John J. Garant, Matthew C. Gorfien | 2025-06-17 |
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Howard H. Chen, Louis L. Hsu, Wolfgang Sauter | 2011-01-11 |
| 7405108 | Methods for forming co-planar wafer-scale chip packages | Howard H. Chen, Louis L. Hsu, Wolfgang Sauter | 2008-07-29 |
| 7294565 | Method of fabricating a wire bond pad with Ni/Au metallization | Charles R. Davis, Ronald D. Goldblatt, William Francis Landers, Sanjay C. Mehta | 2007-11-13 |
| 7250311 | Wirebond crack sensor for low-k die | Toyohiro Aoki, Wolfgang Sauter | 2007-07-31 |
| 7087997 | Copper to aluminum interlayer interconnect using stud and via liner | Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more | 2006-08-08 |
| 7037824 | Copper to aluminum interlayer interconnect using stud and via liner | Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more | 2006-05-02 |
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad | Kwong Hon Wong, Adreanne Kelly, Samuel McKnight | 2005-11-01 |
| 6908841 | Support structures for wirebond regions of contact pads over low modulus materials | Douglas W. Kemerer, Henry A. Nye, III, Hans-Joachim Barth, Emmanuel F. Crabbe, David F. Anderson +1 more | 2005-06-21 |
| 6559042 | Process for forming fusible links | Hans-Joachim Barth, Gerald Friese, Michael Stetter | 2003-05-06 |