Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Lloyd Burrell — 10 Patents

IBM: 9 patents #11,946 of 70,183Top 20%
GUGlobalfoundries U.S.: 1 patents #363 of 665Top 55%
Infineon Technologies Ag: 1 patents #4,631 of 7,486Top 65%
Poughkeepsie, NY: #382 of 1,613 inventorsTop 25%
New York: #14,754 of 115,490 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Lloyd Burrell has been granted 10 US patents while listed as an inventor at IBM. The first was granted in 2003 and the most recent in June 2025. Lloyd Burrell ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Lloyd Burrell in Poughkeepsie, NY, US.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12334461 Bonding structure using two oxide layers with different stress levels, and related method Jorge A. Lubguban, Sarah H. Knickerbocker, John J. Garant, Matthew C. Gorfien 2025-06-17
7867820 Methods for forming co-planar wafer-scale chip packages Howard H. Chen, Louis L. Hsu, Wolfgang Sauter 2011-01-11 $2,856,000
7405108 Methods for forming co-planar wafer-scale chip packages Howard H. Chen, Louis L. Hsu, Wolfgang Sauter 2008-07-29 $9,815,000
7294565 Method of fabricating a wire bond pad with Ni/Au metallization Charles R. Davis, Ronald D. Goldblatt, William Francis Landers, Sanjay C. Mehta 2007-11-13 $7,366,000
7250311 Wirebond crack sensor for low-k die Toyohiro Aoki, Wolfgang Sauter 2007-07-31 $9,877,000
7087997 Copper to aluminum interlayer interconnect using stud and via liner Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more 2006-08-08 $2,377,000
7037824 Copper to aluminum interlayer interconnect using stud and via liner Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more 2006-05-02 $4,743,000
6960831 Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad Kwong Hon Wong, Adreanne Kelly, Samuel McKnight 2005-11-01 $6,114,000
6908841 Support structures for wirebond regions of contact pads over low modulus materials Douglas W. Kemerer, Henry A. Nye, III, Hans-Joachim Barth, Emmanuel F. Crabbe, David F. Anderson +1 more 2005-06-21
6559042 Process for forming fusible links Hans-Joachim Barth, Gerald Friese, Michael Stetter 2003-05-06 $19,022,000