| 12334461 |
Bonding structure using two oxide layers with different stress levels, and related method |
Jorge A. Lubguban, Sarah H. Knickerbocker, John J. Garant, Matthew C. Gorfien |
2025-06-17 |
| 7867820 |
Methods for forming co-planar wafer-scale chip packages |
Howard H. Chen, Louis L. Hsu, Wolfgang Sauter |
2011-01-11 |
| 7405108 |
Methods for forming co-planar wafer-scale chip packages |
Howard H. Chen, Louis L. Hsu, Wolfgang Sauter |
2008-07-29 |
| 7294565 |
Method of fabricating a wire bond pad with Ni/Au metallization |
Charles R. Davis, Ronald D. Goldblatt, William Francis Landers, Sanjay C. Mehta |
2007-11-13 |
| 7250311 |
Wirebond crack sensor for low-k die |
Toyohiro Aoki, Wolfgang Sauter |
2007-07-31 |
| 7087997 |
Copper to aluminum interlayer interconnect using stud and via liner |
Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more |
2006-08-08 |
| 7037824 |
Copper to aluminum interlayer interconnect using stud and via liner |
Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee, Mark D. Levy +6 more |
2006-05-02 |
| 6960831 |
Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad |
Kwong Hon Wong, Adreanne Kelly, Samuel McKnight |
2005-11-01 |
| 6908841 |
Support structures for wirebond regions of contact pads over low modulus materials |
Douglas W. Kemerer, Henry A. Nye, III, Hans-Joachim Barth, Emmanuel F. Crabbe, David F. Anderson +1 more |
2005-06-21 |
| 6559042 |
Process for forming fusible links |
Hans-Joachim Barth, Gerald Friese, Michael Stetter |
2003-05-06 |
