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Bonding structure using two oxide layers with different stress levels, and related method |
Jorge A. Lubguban, Sarah H. Knickerbocker, Lloyd Burrell, Matthew C. Gorfien |
2025-06-17 |
| 10049909 |
Wafer handler and methods of manufacture |
Jonathan H. Griffith, Brittany L. Hedrick, Edmund J. Sprogis |
2018-08-14 |
| 9805977 |
Integrated circuit structure having through-silicon via and method of forming same |
Vijay Sukumaran, Thuy L. Tran-Quinn, Jorge A. Lubguban |
2017-10-31 |
| 9613842 |
Wafer handler and methods of manufacture |
Jonathan H. Griffith, Brittany L. Hedrick, Edmund J. Sprogis |
2017-04-04 |
| 9498837 |
Vacuum transition for solder bump mold filling |
Robert Haas, Bouwe W. Leenstra, Phillip W. Palmatier |
2016-11-22 |
| 9278401 |
Fill head interface with combination vacuum pressure chamber |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, Peter A. Gruber, John P. Karidis +5 more |
2016-03-08 |
| 8123088 |
Dispensing assembly with a controlled gas environment |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John P. Karidis, Christopher L. Tessler +1 more |
2012-02-28 |
| 8123089 |
Dispensing assembly with an injector controlled gas environment |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, G. Gerard Gormley, John P. Karidis +2 more |
2012-02-28 |
| 7833897 |
Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface |
Sarah H. Knickerbocker, Sean A. Allen, Jerry A. Gorrell, Phillip W. Palmatier, Christopher L. Tessler |
2010-11-16 |
| 7401637 |
Pressure-only molten metal valving apparatus and method |
Glen N. Biggs, Peter A. Gruber, Bouwe W. Leenstra, Christopher L. Tessler, Thomas Weiss |
2008-07-22 |
| 6662718 |
Screening mask having a stress-relieving area |
Evelyn Barrington, Jeffrey A. Brody, Harry D. Cox, Lorraine Di Piero-Simmonds, Dinesh Gupta +7 more |
2003-12-16 |
| 6631675 |
Screening method for double pass screening |
Jeffrey A. Brody, Harry D. Cox, Dinesh Gupta, Dale W. Snowdon |
2003-10-14 |
| 6569496 |
CVD of metals capable of receiving nickel or alloys thereof using inert contact |
Donald R. Wall, Kevin M. Prettyman, Srinivasa S. N. Reddy |
2003-05-27 |
| 6348233 |
Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates |
Jeffrey A. Brody, Harry D. Cox, Hsichang Liu, Paul G. McLaughlin, Tom Wayson |
2002-02-19 |
| 6227943 |
Method and system for pre-cleaning and post-cleaning deposited metal |
Charles H. Perry, Srinivasa S. N. Reddy, Donald R. Wall |
2001-05-08 |
| 6224682 |
CVD of metals capable of receiving nickel or alloys thereof using inert contact |
Donald R. Wall, Kevin M. Prettyman, Srinivasa S. N. Reddy |
2001-05-01 |
| 6217989 |
Conductive line features for enhanced reliability of multi-layer ceramic substrates |
Jeffrey A. Brody, Harry D. Cox, Hsichang Liu, Paul G. McLaughlin, Tom Wayson |
2001-04-17 |
| 5866470 |
Method of using an interface layer for stacked lamination sizing and sintering |
Jon A. Casey, Michael A. Cohn, Abubaker S. Shagan, Candace A. Sullivan, Robert J. Sullivan +1 more |
1999-02-02 |
| 5755903 |
Method of making a multilayer ceramic substrate having reduced stress |
Richard F. Indyk |
1998-05-26 |
| 5700549 |
Structure to reduce stress in multilayer ceramic substrates |
Richard F. Indyk |
1997-12-23 |
