Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334461 | Bonding structure using two oxide layers with different stress levels, and related method | Jorge A. Lubguban, Sarah H. Knickerbocker, Lloyd Burrell, Matthew C. Gorfien | 2025-06-17 |
| 10049909 | Wafer handler and methods of manufacture | Jonathan H. Griffith, Brittany L. Hedrick, Edmund J. Sprogis | 2018-08-14 |
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Vijay Sukumaran, Thuy L. Tran-Quinn, Jorge A. Lubguban | 2017-10-31 |
| 9613842 | Wafer handler and methods of manufacture | Jonathan H. Griffith, Brittany L. Hedrick, Edmund J. Sprogis | 2017-04-04 |
| 9498837 | Vacuum transition for solder bump mold filling | Robert Haas, Bouwe W. Leenstra, Phillip W. Palmatier | 2016-11-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, Peter A. Gruber, John P. Karidis +5 more | 2016-03-08 |
| 8123088 | Dispensing assembly with a controlled gas environment | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John P. Karidis, Christopher L. Tessler +1 more | 2012-02-28 |
| 8123089 | Dispensing assembly with an injector controlled gas environment | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, G. Gerard Gormley, John P. Karidis +2 more | 2012-02-28 |
| 7833897 | Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface | Sarah H. Knickerbocker, Sean A. Allen, Jerry A. Gorrell, Phillip W. Palmatier, Christopher L. Tessler | 2010-11-16 |
| 7401637 | Pressure-only molten metal valving apparatus and method | Glen N. Biggs, Peter A. Gruber, Bouwe W. Leenstra, Christopher L. Tessler, Thomas Weiss | 2008-07-22 |
| 6662718 | Screening mask having a stress-relieving area | Evelyn Barrington, Jeffrey A. Brody, Harry D. Cox, Lorraine Di Piero-Simmonds, Dinesh Gupta +7 more | 2003-12-16 |
| 6631675 | Screening method for double pass screening | Jeffrey A. Brody, Harry D. Cox, Dinesh Gupta, Dale W. Snowdon | 2003-10-14 |
| 6569496 | CVD of metals capable of receiving nickel or alloys thereof using inert contact | Donald R. Wall, Kevin M. Prettyman, Srinivasa S. N. Reddy | 2003-05-27 |
| 6348233 | Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates | Jeffrey A. Brody, Harry D. Cox, Hsichang Liu, Paul G. McLaughlin, Tom Wayson | 2002-02-19 |
| 6227943 | Method and system for pre-cleaning and post-cleaning deposited metal | Charles H. Perry, Srinivasa S. N. Reddy, Donald R. Wall | 2001-05-08 |
| 6224682 | CVD of metals capable of receiving nickel or alloys thereof using inert contact | Donald R. Wall, Kevin M. Prettyman, Srinivasa S. N. Reddy | 2001-05-01 |
| 6217989 | Conductive line features for enhanced reliability of multi-layer ceramic substrates | Jeffrey A. Brody, Harry D. Cox, Hsichang Liu, Paul G. McLaughlin, Tom Wayson | 2001-04-17 |
| 5866470 | Method of using an interface layer for stacked lamination sizing and sintering | Jon A. Casey, Michael A. Cohn, Abubaker S. Shagan, Candace A. Sullivan, Robert J. Sullivan +1 more | 1999-02-02 |
| 5755903 | Method of making a multilayer ceramic substrate having reduced stress | Richard F. Indyk | 1998-05-26 |
| 5700549 | Structure to reduce stress in multilayer ceramic substrates | Richard F. Indyk | 1997-12-23 |