| 11053604 |
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2021-07-06 |
| 10895017 |
Prevent and remove organics from reservoir wells |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2021-01-19 |
| 10718062 |
Prevent and remove organics from reservoir wells |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2020-07-21 |
| 10450667 |
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2019-10-22 |
| 10392720 |
Prevent and remove organics from reservoir wells |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2019-08-27 |
| 10087546 |
Prevent and remove organics from reservoir wells |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2018-10-02 |
| 10053794 |
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2018-08-21 |
| 9777388 |
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution |
Charles L. Arvin, Glen N. Biggs, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres |
2017-10-03 |
| 9498837 |
Vacuum transition for solder bump mold filling |
John J. Garant, Robert Haas, Bouwe W. Leenstra |
2016-11-22 |
| 9428841 |
Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution |
Charles L. Arvin, Stephen G. Dutka, John R. Pennacchia, Freddie Torres |
2016-08-30 |
| 9278401 |
Fill head interface with combination vacuum pressure chamber |
Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber +5 more |
2016-03-08 |
| 7833897 |
Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface |
Sarah H. Knickerbocker, Sean A. Allen, John J. Garant, Jerry A. Gorrell, Christopher L. Tessler |
2010-11-16 |
| 6241868 |
Method for electroplating a film onto a substrate |
Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Suryanarayana Kaja, Ashwani K. Malhotra |
2001-06-05 |
| 6080289 |
Electroplating apparatus with self-cleaning contacts |
Tracy A. Tong |
2000-06-27 |
| 6077405 |
Method and apparatus for making electrical contact to a substrate during electroplating |
Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Suryanarayana Kaja, Ashwani K. Malhotra |
2000-06-20 |
| 5869139 |
Apparatus and method for plating pin grid array packaging modules |
Glen N. Biggs, John Di Santis, Paul F. Findeis, Karen P. McLaughlin, Victor M. Vitek |
1999-02-09 |
