Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Suryanarayana Kaja — 26 Patents

IBM: 23 patents #4,699 of 70,183Top 7%
MPMagnetic Peripherals: 3 patents #16 of 149Top 15%
Eden Prairie, MN: #102 of 1,491 inventorsTop 7%
Minnesota: #2,446 of 52,454 inventorsTop 5%
Overall (All Time): #150,017 of 4,157,543Top 4%
26 Patents All Time
Suryanarayana Kaja has been granted 26 US patents while listed as an inventor at IBM. The first was granted in 1988 and the most recent in December 2003. Suryanarayana Kaja ranks #150,017 of 4,157,543 US inventors in our database (top 3.6%). Patent records list Suryanarayana Kaja in Eden Prairie, MN, US.

Patents per Year

Patents granted per year, 1988 to 2003Bar chart with a peak of 4 patents in 2000.peak 41988: 1 patents19881989: 2 patents19891995: 3 patents19951996: 3 patents19961998: 2 patents19981999: 3 patents19992000: 4 patents20002001: 4 patents20012002: 2 patents20022003: 2 patents2003

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
6669833 Process and apparatus for electroplating microscopic features uniformly across a large substrate Chandrika Prasad, RongQing Yu 2003-12-30 $8,971,000
6638374 Device produced by a process of controlling grain growth in metal films Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Michele S. Legere, Eric D. Perfecto 2003-10-28 $14,845,000
6455331 Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more 2002-09-24 $8,983,000
6361627 Process of controlling grain growth in metal films Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Michele S. Legere, Eric D. Perfecto 2002-03-26 $26,805,000
6329609 Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology Chandrika Prasad, RongQing Yu 2001-12-11 $30,954,000
6271111 High density pluggable connector array and process thereof Shaji Farooq, Li-Kong Wang 2001-08-07 $22,988,000
6248599 Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more 2001-06-19 $38,179,000
6241868 Method for electroplating a film onto a substrate Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Ashwani K. Malhotra, Phillip W. Palmatier 2001-06-05 $46,299,000
6131796 Direct brazing of refractory metal features Srinivasa N. Reddy, Donald R. Wall 2000-10-17 $30,556,000
6126761 Process of controlling grain growth in metal films Patrick W. DeHaven, Charles C. Goldsmith, Jeffrey Louis Hurd, Michele S. Legere, Eric D. Perfecto 2000-10-03 $31,821,000
6077405 Method and apparatus for making electrical contact to a substrate during electroplating Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Ashwani K. Malhotra, Phillip W. Palmatier 2000-06-20 $29,799,000
6048741 Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more 2000-04-11 $38,584,000
5985128 Method of performing processes on features with electricity Shaji Farooq, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing 1999-11-16 $28,261,000
5935404 Method of performing processes on features with electricity Shaji Farooq, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing 1999-08-10 $20,467,000
5898222 Capped copper electrical interconnects Mukta S. Farooq, Eric D. Perfecto, George E. White 1999-04-27 $19,884,000
5787578 Method of selectively depositing a metallic layer on a ceramic substrate Shaji Farooq, John U. Knickerbocker, Brenda Peterson, Srinivasan N. Reddy, Rao V. Vallabhaneni +1 more 1998-08-04 $10,071,000
5705857 Capped copper electrical interconnects Mukta S. Farooq, Eric D. Perfecto, George E. White 1998-01-06 $19,122,000
5549808 Method for forming capped copper electrical interconnects Mukta S. Farooq, Eric D. Perfecto, George E. White 1996-08-27 $10,770,000
5545927 Capped copper electrical interconnects Mukta S. Farooq, Eric D. Perfecto, George E. White 1996-08-13 $8,302,000
5483105 Module input-output pad having stepped set-back Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy, Vivek M. Sura +1 more 1996-01-09 $10,524,000
5453642 Multilayer interconnect systems Eugene J. O'Sullivan, Alejandro G. Schrott 1995-09-26 $11,469,000
5382447 Process for fabricating improved multilayer interconnect systems Eugene J. O'Sullivan, Alejandro G. Schrott 1995-01-17 $19,874,000
5380560 Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition Shyama Mukherjee, Eugene J. O'Sullivan, Milan Paunovic 1995-01-10 $13,547,000
4860572 Apparatus and methods for testing surface properties of a material Amarjit S. Brar, Jagdish P. Sharma 1989-08-29
4821578 Apparatus and methods for testing surface properties of a material Amarjit S. Brar, Jagdish P. Sherma 1989-04-18