Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669833 | Process and apparatus for electroplating microscopic features uniformly across a large substrate | Chandrika Prasad, RongQing Yu | 2003-12-30 |
| 6638374 | Device produced by a process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Michele S. Legere, Eric D. Perfecto | 2003-10-28 |
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more | 2002-09-24 |
| 6361627 | Process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffery L. Hurd, Michele S. Legere, Eric D. Perfecto | 2002-03-26 |
| 6329609 | Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology | Chandrika Prasad, RongQing Yu | 2001-12-11 |
| 6271111 | High density pluggable connector array and process thereof | Shaji Farooq, Li-Kong Wang | 2001-08-07 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more | 2001-06-19 |
| 6241868 | Method for electroplating a film onto a substrate | Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Ashwani K. Malhotra, Phillip W. Palmatier | 2001-06-05 |
| 6131796 | Direct brazing of refractory metal features | Srinivasa N. Reddy, Donald R. Wall | 2000-10-17 |
| 6126761 | Process of controlling grain growth in metal films | Patrick W. DeHaven, Charles C. Goldsmith, Jeffrey Louis Hurd, Michele S. Legere, Eric D. Perfecto | 2000-10-03 |
| 6077405 | Method and apparatus for making electrical contact to a substrate during electroplating | Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Ashwani K. Malhotra, Phillip W. Palmatier | 2000-06-20 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Kimberley A. Kelly, Yeeling L. Lee +3 more | 2000-04-11 |
| 5985128 | Method of performing processes on features with electricity | Shaji Farooq, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-11-16 |
| 5935404 | Method of performing processes on features with electricity | Shaji Farooq, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim H. Ruffing | 1999-08-10 |
| 5898222 | Capped copper electrical interconnects | Mukta S. Farooq, Eric D. Perfecto, George E. White | 1999-04-27 |
| 5787578 | Method of selectively depositing a metallic layer on a ceramic substrate | Shaji Farooq, John U. Knickerbocker, Brenda Peterson, Srinivasan N. Reddy, Rao V. Vallabhaneni +1 more | 1998-08-04 |
| 5705857 | Capped copper electrical interconnects | Mukta S. Farooq, Eric D. Perfecto, George E. White | 1998-01-06 |
| 5549808 | Method for forming capped copper electrical interconnects | Mukta S. Farooq, Eric D. Perfecto, George E. White | 1996-08-27 |
| 5545927 | Capped copper electrical interconnects | Mukta S. Farooq, Eric D. Perfecto, George E. White | 1996-08-13 |
| 5483105 | Module input-output pad having stepped set-back | Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy, Vivek M. Sura +1 more | 1996-01-09 |
| 5453642 | Multilayer interconnect systems | Eugene J. O'Sullivan, Alejandro G. Schrott | 1995-09-26 |
| 5382447 | Process for fabricating improved multilayer interconnect systems | Eugene J. O'Sullivan, Alejandro G. Schrott | 1995-01-17 |
| 5380560 | Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition | Shyama Mukherjee, Eugene J. O'Sullivan, Milan Paunovic | 1995-01-10 |
| 4860572 | Apparatus and methods for testing surface properties of a material | Amarjit S. Brar, Jagdish P. Sharma | 1989-08-29 |
| 4821578 | Apparatus and methods for testing surface properties of a material | Amarjit S. Brar, Jagdish P. Sherma | 1989-04-18 |