| 7901490 |
Reducing introduction of foreign material to wafers |
David J. Clark, Alison K. Easton, James H. Peterman |
2011-03-08 |
| 7678258 |
Void-free damascene copper deposition process and means of monitoring thereof |
Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, Keith Kwietniak, Peter S. Locke +4 more |
2010-03-16 |
| 7407605 |
Manufacturable CoWP metal cap process for copper interconnects |
Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry +1 more |
2008-08-05 |
| 7253106 |
Manufacturable CoWP metal cap process for copper interconnects |
Darryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Sean Smith, Richard O. Henry +1 more |
2007-08-07 |
| 7227265 |
Electroplated copper interconnection structure, process for making and electroplating bath |
Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, Wilma Jean Horkans +6 more |
2007-06-05 |
| 6627052 |
Electroplating apparatus with vertical electrical contact |
Peter S. Locke, Yuet-Ying Yu |
2003-09-30 |
| 6471845 |
Method of controlling chemical bath composition in a manufacturing environment |
John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Peter S. Locke, Panayotis Andricacos +2 more |
2002-10-29 |
| 6395164 |
Copper seed layer repair technique using electroless touch-up |
Panayotis Andricacos, John G. Gaudiello, Ronald D. Goldblatt, Sandra G. Malhotra, Milan Paunovic |
2002-05-28 |
| 6270646 |
Electroplating apparatus and method using a compressible contact |
Erick G. Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni +4 more |
2001-08-07 |
| 6241868 |
Method for electroplating a film onto a substrate |
Glen N. Biggs, Donald M. Brewer, Suryanarayana Kaja, Ashwani K. Malhotra, Phillip W. Palmatier |
2001-06-05 |
| 6077405 |
Method and apparatus for making electrical contact to a substrate during electroplating |
Glen N. Biggs, Donald M. Brewer, Suryanarayana Kaja, Ashwani K. Malhotra, Phillip W. Palmatier |
2000-06-20 |
