Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof | Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak +4 more | 2010-03-16 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath | Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel +6 more | 2007-06-05 |
| 7207096 | Method of manufacturing high performance copper inductors with bond pads | Jeffrey P. Gambino, William T. Motsiff | 2007-04-24 |
| 7052925 | Method for manufacturing self-compensating resistors within an integrated circuit | William J. Murphy, Edmund J. Sprogis, Anthony K. Stamper | 2006-05-30 |
| 7015580 | Roughened bonding pad and bonding wire surfaces for low pressure wire bonding | John A. Fitzsimmons, Jeffrey P. Gambino | 2006-03-21 |
| 6605534 | Selective deposition of a conductive material | Dean S. Chung, David V. Horak | 2003-08-12 |
| 6471845 | Method of controlling chemical bath composition in a manufacturing environment | John O. Dukovic, William E. Corbin, Jr., Peter S. Locke, Panayotis Andricacos, James E. Fluegel +2 more | 2002-10-29 |
| 6409903 | Multi-step potentiostatic/galvanostatic plating control | Dean S. Chung, Josef W. Korejwa | 2002-06-25 |
| 6270646 | Electroplating apparatus and method using a compressible contact | Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni, Daniel C. Edelstein +4 more | 2001-08-07 |
| 6110832 | Method and apparatus for slurry polishing | Clifford Owen Morgan, III, Matthew J. Rutten, Terrance M. Wright | 2000-08-29 |
| 6054339 | Fusible links formed on interconnects which are at least twice as long as they are deep | Richard A. Gilmour, Ronald R. Uttecht | 2000-04-25 |
| 5997392 | Slurry injection technique for chemical-mechanical polishing | Timothy Scott Chamberlin, Matthew Miller | 1999-12-07 |
| 5877589 | Gas discharge devices including matrix materials with ionizable gas filled sealed cavities | Clifford Owen Morgan, III, Matthew J. Rutten, Terrance M. Wright | 1999-03-02 |
| 5876266 | Polishing pad with controlled release of desired micro-encapsulated polishing agents | Matthew Miller, Clifford Owen Morgan, III, Matthew J. Rutten, Terrance M. Wright | 1999-03-02 |
| 5766971 | Oxide strip that improves planarity | David C. Ahlgren, Gary B. Bronner, Wesley C. Natzle, Chienfan Yu | 1998-06-16 |
| 5760674 | Fusible links with improved interconnect structure | Richard A. Gilmour, Ronald R. Uttecht | 1998-06-02 |
| 5723898 | Array protection devices and method | Richard A. Gilmour, Thomas J. Hartswick, David C. Thomas, Ronald R. Uttecht | 1998-03-03 |
| 5523253 | Array protection devices and fabrication method | Richard A. Gilmour, Thomas J. Hartswick, David C. Thomas, Ronald R. Uttecht | 1996-06-04 |
| 5420455 | Array fuse damage protection devices and fabrication method | Richard A. Gilmour, Thomas J. Hartswick, David C. Thomas, Ronald R. Uttecht | 1995-05-30 |
| 5286572 | Planarizing ladder-type silsequioxane polymer insulation layer | Donna J. Clodgo, Rosemary A. Previti-Kelly, Ronald R. Uttecht | 1994-02-15 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5134460 | Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding | Michael John Brady, Sung Kwon Kang, Paul A. Moskowitz, James G. Ryan, Timothy C. Reiley +2 more | 1992-07-28 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 4981530 | Planarizing ladder-type silsesquioxane polymer insulation layer | Donna J. Clodgo, Rosemary A. Previti-Kelly, Ronald R. Uttecht | 1991-01-01 |
| 4840302 | Chromium-titanium alloy | David A. Gardner, James G. Ryan, Joseph G. Schaefer | 1989-06-20 |