Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505344 | Apparatus and method for forming and applying edge protectors | Jeffrey D. Termanas, Janusz Ciurkot | 2022-11-22 |
| 10099808 | Apparatus and method for forming and applying edge protectors | Jeffrey D. Termanas, Janusz Ciurkot | 2018-10-16 |
| 9825119 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-11-21 |
| 9825120 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-11-21 |
| 9607929 | Tsv wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2017-03-28 |
| 9548349 | Semiconductor device with metal extrusion formation | Max G. Levy, Gary L. Milo | 2017-01-17 |
| 9484301 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +1 more | 2016-11-01 |
| 9312205 | Methods of forming a TSV wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2016-04-12 |
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy +1 more | 2016-03-01 |
| 9087839 | Semiconductor structures with metal lines | Shawn A. Adderly, Daniel A. Delibac, Zhong-Xiang He, Matthew D. Moon, Anthony C. Speranza +2 more | 2015-07-21 |
| 9059258 | Controlled metal extrusion opening in semiconductor structure and method of forming | Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +1 more | 2015-06-16 |
| 9006703 | Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof | Shawn A. Adderly, Brian M. Czabaj, Daniel A. Delibac, Jeffrey P. Gambino, Matthew D. Moon | 2015-04-14 |
| 8592941 | Fuse structure having crack stop void, method for forming and programming same, and design structure | Jeffrey P. Gambino, Tom C. Lee, Kevin G. Petrunich | 2013-11-26 |
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-12-27 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-08-23 |
| 7977053 | Circular probe amplification (CPA) using energy-transfer primers | — | 2011-07-12 |
| 7530572 | Active dealer version of blackjack | Mark Jerome Koetting | 2009-05-12 |
| 7523941 | Active dealer version of blackjack | Mark Jerome Koetting | 2009-04-28 |
| 6982227 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray +4 more | 2006-01-03 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray +4 more | 2004-01-06 |
| 6340601 | Method for reworking copper metallurgy in semiconductor devices | Thomas F. Curran, Timothy C. Krywanczyk, Michael S. Lube, Matthew D. Moon, Rock Nadeau +6 more | 2002-01-22 |
| 5882999 | Process for metallization of an insulation layer | Christine Ann Anderson, Edward D. Buker, John Cronin, Gloria Kerszykowski | 1999-03-16 |
| 5723898 | Array protection devices and method | Richard A. Gilmour, Thomas J. Hartswick, Ronald R. Uttecht, Erick G. Walton | 1998-03-03 |
| 5523253 | Array protection devices and fabrication method | Richard A. Gilmour, Thomas J. Hartswick, Ronald R. Uttecht, Erick G. Walton | 1996-06-04 |
| 5420455 | Array fuse damage protection devices and fabrication method | Richard A. Gilmour, Thomas J. Hartswick, Ronald R. Uttecht, Erick G. Walton | 1995-05-30 |