Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7838423 | Method of forming capping structures on one or more material layer surfaces | Arthur J. Learn, Steven R. Sherman, John Hautala | 2010-11-23 |
| 7799683 | Copper interconnect wiring and method and apparatus for forming thereof | Arthur J. Learn, Steven R. Sherman, John Hautala | 2010-09-21 |
| 7759251 | Dual damascene integration structure and method for forming improved dual damascene integration structure | John Hautala | 2010-07-20 |
| 7655547 | Metal spacer in single and dual damascene processing | Edward C. Cooney, III, Anthony K. Stamper | 2010-02-02 |
| 7393777 | Sacrificial metal spacer damascene process | Edward C. Cooney, III, Anthony K. Stamper | 2008-07-01 |
| 7381637 | Metal spacer in single and dual damascence processing | Edward C. Cooney, III, Anthony K. Stamper | 2008-06-03 |
| 7358148 | Adjustable self-aligned air gap dielectric for low capacitance wiring | William T. Motsiff | 2008-04-15 |
| 7291558 | Copper interconnect wiring and method of forming thereof | John Hautala, Steven R. Sherman, Arthur J. Learn | 2007-11-06 |
| 7071532 | Adjustable self-aligned air gap dielectric for low capacitance wiring | William T. Motsiff | 2006-07-04 |
| 6982227 | Single and multilevel rework | Edward C. Cooney, III, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2006-01-03 |
| 6939791 | Contact capping local interconnect | David V. Horak, Anthony K. Stamper | 2005-09-06 |
| 6888251 | Metal spacer in single and dual damascene processing | Edward C. Cooney, III, Anthony K. Stamper | 2005-05-03 |
| 6846741 | Sacrificial metal spacer damascene process | Edward C. Cooney, III, Anthony K. Stamper | 2005-01-25 |
| 6746947 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Daniel C. Edelstein, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman | 2004-06-08 |
| 6680514 | Contact capping local interconnect | David V. Horak, Anthony K. Stamper | 2004-01-20 |
| 6674168 | Single and multilevel rework | Edward C. Cooney, III, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2004-01-06 |
| 6548338 | Integrated high-performance decoupling capacitor and heat sink | Kerry Bernstein, Wilbur D. Pricer, Anthony K. Stamper, Steven H. Voldman | 2003-04-15 |
| 6503827 | Method of reducing planarization defects | Susan G. Bombardier, Paul M. Feeney, David V. Horak, Matthew J. Rutten | 2003-01-07 |
| 6498385 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Daniel C. Edelstein, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman | 2002-12-24 |
| 6495917 | Method and structure of column interconnect | John J. Ellis-Monaghan, Paul M. Feeney, Howard S. Landis, Rosemary A. Previti-Kelly, Bette L. Bergman Reuter +3 more | 2002-12-17 |
| 6452251 | Damascene metal capacitor | Kerry Bernstein, Anthony K. Stamper, Stephen A. St. Onge | 2002-09-17 |
| 6426249 | Buried metal dual damascene plate capacitor | Anthony K. Stamper | 2002-07-30 |
| 6426558 | Metallurgy for semiconductor devices | Jonathan D. Chapple-Sokol, Paul M. Feeney, David V. Horak, Mark P. Murray, Anthony K. Stamper | 2002-07-30 |
| 6420263 | Method for controlling extrusions in aluminum metal lines and the device formed therefrom | Roger W. Cheek, George A. Dunbar, III, William J. Murphy, Prabhat Tiwari, David H. Yao | 2002-07-16 |
| 6344373 | Antifuse structure and process | Arup Bhattacharyya, Chung H. Lam, Robert K. Leidy | 2002-02-05 |