| 7838423 |
Method of forming capping structures on one or more material layer surfaces |
Arthur J. Learn, Steven R. Sherman, John Hautala |
2010-11-23 |
|
| 7799683 |
Copper interconnect wiring and method and apparatus for forming thereof |
Arthur J. Learn, Steven R. Sherman, John Hautala |
2010-09-21 |
|
| 7759251 |
Dual damascene integration structure and method for forming improved dual damascene integration structure |
John Hautala |
2010-07-20 |
|
| 7655547 |
Metal spacer in single and dual damascene processing |
Edward C. Cooney, III, Anthony K. Stamper |
2010-02-02 |
$8,575,000 |
| 7393777 |
Sacrificial metal spacer damascene process |
Edward C. Cooney, III, Anthony K. Stamper |
2008-07-01 |
$7,630,000 |
| 7381637 |
Metal spacer in single and dual damascence processing |
Edward C. Cooney, III, Anthony K. Stamper |
2008-06-03 |
$7,325,000 |
| 7358148 |
Adjustable self-aligned air gap dielectric for low capacitance wiring |
William T. Motsiff |
2008-04-15 |
$8,007,000 |
| 7291558 |
Copper interconnect wiring and method of forming thereof |
John Hautala, Steven R. Sherman, Arthur J. Learn |
2007-11-06 |
|
| 7071532 |
Adjustable self-aligned air gap dielectric for low capacitance wiring |
William T. Motsiff |
2006-07-04 |
|
| 6982227 |
Single and multilevel rework |
Edward C. Cooney, III, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more |
2006-01-03 |
$6,490,000 |
| 6939791 |
Contact capping local interconnect |
David V. Horak, Anthony K. Stamper |
2005-09-06 |
$5,379,000 |
| 6888251 |
Metal spacer in single and dual damascene processing |
Edward C. Cooney, III, Anthony K. Stamper |
2005-05-03 |
$8,163,000 |
| 6846741 |
Sacrificial metal spacer damascene process |
Edward C. Cooney, III, Anthony K. Stamper |
2005-01-25 |
$10,247,000 |
| 6746947 |
Post-fuse blow corrosion prevention structure for copper fuses |
Timothy H. Daubenspeck, Daniel C. Edelstein, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman |
2004-06-08 |
$6,083,000 |
| 6680514 |
Contact capping local interconnect |
David V. Horak, Anthony K. Stamper |
2004-01-20 |
$10,094,000 |
| 6674168 |
Single and multilevel rework |
Edward C. Cooney, III, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more |
2004-01-06 |
$7,683,000 |
| 6548338 |
Integrated high-performance decoupling capacitor and heat sink |
Kerry Bernstein, Wilbur D. Pricer, Anthony K. Stamper, Steven H. Voldman |
2003-04-15 |
$16,310,000 |
| 6503827 |
Method of reducing planarization defects |
Susan G. Bombardier, Paul M. Feeney, David V. Horak, Matthew J. Rutten |
2003-01-07 |
$16,905,000 |
| 6498385 |
Post-fuse blow corrosion prevention structure for copper fuses |
Timothy H. Daubenspeck, Daniel C. Edelstein, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman |
2002-12-24 |
$23,154,000 |
| 6495917 |
Method and structure of column interconnect |
John J. Ellis-Monaghan, Paul M. Feeney, Howard S. Landis, Rosemary A. Previti-Kelly, Bette L. Bergman Reuter +3 more |
2002-12-17 |
$17,155,000 |
| 6452251 |
Damascene metal capacitor |
Kerry Bernstein, Anthony K. Stamper, Stephen A. St. Onge |
2002-09-17 |
$8,846,000 |
| 6426558 |
Metallurgy for semiconductor devices |
Jonathan D. Chapple-Sokol, Paul M. Feeney, David V. Horak, Mark P. Murray, Anthony K. Stamper |
2002-07-30 |
$10,205,000 |
| 6426249 |
Buried metal dual damascene plate capacitor |
Anthony K. Stamper |
2002-07-30 |
$10,205,000 |
| 6420263 |
Method for controlling extrusions in aluminum metal lines and the device formed therefrom |
Roger W. Cheek, George A. Dunbar, III, William J. Murphy, Prabhat Tiwari, David H. Yao |
2002-07-16 |
$9,944,000 |
| 6344373 |
Antifuse structure and process |
Arup Bhattacharyya, Chung H. Lam, Robert K. Leidy |
2002-02-05 |
$11,026,000 |
