Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6300236 | Copper stud structure with refractory metal liner | James M. E. Harper | 2001-10-09 |
| 6236103 | Integrated high-performance decoupling capacitor and heat sink | Kerry Bernstein, Wilbur D. Pricer, Anthony K. Stamper, Steven H. Voldman | 2001-05-22 |
| 6180498 | Alignment targets having enhanced contrast | Robert K. Leidy | 2001-01-30 |
| 6150723 | Copper stud structure with refractory metal liner | James M. E. Harper | 2000-11-21 |
| 6093630 | Semi-conductor personalization structure and method | William T. Motsiff, Ronald R. Uttecht | 2000-07-25 |
| 5985762 | Method of forming a self-aligned copper diffusion barrier in vias | Stephen E. Luce | 1999-11-16 |
| 5898227 | Alignment targets having enhanced contrast | Robert K. Leidy | 1999-04-27 |
| 5883435 | Personalization structure for semiconductor devices | William T. Motsiff, Ronald R. Uttecht | 1999-03-16 |
| 5811870 | Antifuse structure | Arup Bhattacharyya, Chung H. Lam, Robert K. Leidy | 1998-09-22 |
| 5795819 | Integrated pad and fuse structure for planar copper metallurgy | William T. Motsiff, Ronald R. Uttecht | 1998-08-18 |
| 5731624 | Integrated pad and fuse structure for planar copper metallurgy | William T. Motsiff, Ronald R. Uttecht | 1998-03-24 |
| 5719070 | Metallization composite having nickel intermediate/interface | Herbert C. Cook, Paul A. Farrar, William T. Motsiff, Adolf E. Wirsing | 1998-02-17 |
| 5585674 | Transverse diffusion barrier interconnect structure | Matthew J. Rutten | 1996-12-17 |
| 5488013 | Method of forming transverse diffusion barrier interconnect structure | Matthew J. Rutten | 1996-01-30 |
| 5457345 | Metallization composite having nickle intermediate/interface | Herbert C. Cook, Paul A. Farrar, William T. Motsiff, Adolf E. Wirsing | 1995-10-10 |
| 5339212 | Sidewall decoupling capacitor | Lawrence J. Dunlop | 1994-08-16 |
| 5126006 | Plural level chip masking | John Cronin, Paul A. Farrar, William H. Guthrie, Carter W. Kaanta, Rosemary A. Previti-Kelly +3 more | 1992-06-30 |
| 4423547 | Method for forming dense multilevel interconnection metallurgy for semiconductor devices | Paul A. Farrar, Charles T. Kroll | 1984-01-03 |