Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7288492 | Method for forming interconnects on thin wafers | Leonard Gardecki, James R. Palmer, Erik M. Probstfield | 2007-10-30 |
| 7138326 | Wafer integrated rigid support ring | Harry D. Cox, David Daniel, Leonard Gardecki, Albert Gregoritsch, Ruth Machell Julianelle +5 more | 2006-11-21 |
| 6951775 | Method for forming interconnects on thin wafers | Leonard Gardecki, James R. Palmer, Erik M. Probstfield | 2005-10-04 |
| 6706621 | Wafer integrated rigid support ring | Harry D. Cox, David Daniel, Leonard Gardecki, Albert Gregoritsch, Ruth Machell Julianelle +5 more | 2004-03-16 |
| 5719070 | Metallization composite having nickel intermediate/interface | Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, William T. Motsiff | 1998-02-17 |
| 5457345 | Metallization composite having nickle intermediate/interface | Herbert C. Cook, Paul A. Farrar, Robert M. Geffken, William T. Motsiff | 1995-10-10 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 5104695 | Method and apparatus for vapor deposition of material onto a substrate | Stuart E. Greer, Eric Ernest Millham | 1992-04-14 |